Precipitation hardened high copper alloys for connector pins made of wire

23rd International Conference on Electrical Contacts, ICEC 2006 - together with the 6th International Session on Electromechanical Devices, IS-EMD 2006

Volumn , Issue , 2006, Pages 257-261

  Zauter, R ^a   Kudashov, D V ^a  

^a Hochschule Berlin   (Germany)

Author keywords

Connector pins; High copper alloys; Precipitation hardening; Wire

Indexed keywords

CONNECTOR PINS; ELECTRICAL CONTACTS; ELECTRONIC INDUSTRIES; HARDENED ALLOY; HIGH-COPPER ALLOYS; PROCESSING PROPERTIES; STRESS RELAXATION RESISTANCE;

AGE HARDENING; ALLOYS; COPPER ALLOYS; DATA HANDLING; ELECTRIC CONTACTS; ELECTROMECHANICAL DEVICES; HARDNESS; WIRE;

PRECIPITATION (CHEMICAL);

EID: 84890351418     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (7)

1. T. B. Massalski (editor), Binary alloy phase diagrams, Vol. 1, American Society for Metals, Metals Park, Ohio, 1986.
2. F. Pawlek, K. Reichel, Der Einfluss von Beimengungen auf die elektrische Leitfähigkeit von Kupfer, Zeitschrift für Metallkunde, Bd. 47 (1956) Heft 6, page 347-356.
3. A. Bögel, Spannungsrelaxation in Kupferlegierungen für Steckverbinder und Federelemente, Metall (48) Nr. 11, 1994, p. 872-876.
4. G. Knoblauch u.a., Steckverbinder, Systemkonzepte und Technogien, Hrsg: W. J. Bartz, expert Verlag, Band 558, 1998, ISBN 3-8169-1560-4.
5. th Annual Connector and Interconnection Symposium and Trade Show, Anaheim CA, Sept. 2001.
6. J. Seeger, H.-A. Kuhn, A. Bögel, I. Buresch, K88/C18080 - A customer designed alloy for connector application, Metall (56) Nr. 5, 2002, p. 289-292.
7. nd Annual Connector and Interconnection Symposium and Trade Show, Anaheim CA, Sept. 1999, p. 111-125.