Viscous hot glass forming for optical wafer level packaging of micro mirrors

Procedia Engineering

Volumn 47, Issue , 2012, Pages 64-67

  Stenchlya, Vanessa ^a   Quenzer, Hans Joachim ^a   Hofmann, Ulrich ^a   Eisermann, Christian ^a   Benecke, Wolfgang ^a  

^a FRAUNHOFER INSTITUTE FOR SILICON TECHNOLOGY ISIT   (Germany)

Author keywords

Glass forming; Micro mirrors; MOEMS; Silicon micro machining; Wafer level packaging

Indexed keywords

EID: 84890017085     PISSN: 18777058     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1016/j.proeng.2012.09.085     Document Type: Conference Paper

References (3)

1. M.Oldsen, U.Hofmann, H.J. Quenzer, B. Wagner, A Novel Fabrication Technology for Waferlevel Vacuum packaged Microscanning Mirrors, Proc. 9th Electronics Packaging Technology Conference, Singapore, (2007).
2. U. Hofmann, M. Oldsen, H.-J. Quenzer, J. Janes, M. Heller, M. Weiss, G. Fakas, L. Ratzmann, E. Marchetti, F. D'Ascoli, M. Melani, L. Bacciarelli, E. Volpi, F. Battini, L. Mostardini, F. Sechi, M. De Marinis and B. Wagner, Wafer-level vacuum packaged resonant micro-scanning mirrors for compact laser projection displays, Proc. SPIE 6887, 688706 (2008).
3. P. Merz, H.J. Quenzer, H. Bernt, B. Wanger, M. Zoberbier, A novel micromachining technology for structuring borosilicate glass substrates, Transducers, Solid-State Sensors, Actuators and Microsystems, 12th International Conference, vol.1, 2003, pp 258 - 261.