Accelerated reliability - Thermal and mechanical fatigue solder joints methodologies

IEEE International Reliability Physics Symposium Proceedings

Volumn 2002-January, Issue , 2002, Pages 144-147

  Strifas, N ^a   Vaughan, C ^a   Ruzzene, M ^b  

^a NAVSEA Dahlgren Division Code G53   (United States)

^b Department of Mechanical Engineering ^*  (United States)

Author keywords

Acceleration; Assembly; Capacitive sensors; Circuit testing; Degradation; Fatigue; Life estimation; Soldering; Thermal resistance; Thermal stresses

Indexed keywords

ACCELERATION; ASSEMBLY; CAPACITIVE SENSORS; DEGRADATION; FATIGUE OF MATERIALS; FINITE ELEMENT METHOD; HEAT RESISTANCE; INTERMETALLICS; LEAD; RELIABILITY; SOLDERING; SURFACE MOUNT TECHNOLOGY; THERMAL STRESS; WEIBULL DISTRIBUTION;

ACCELERATED LIFE; CIRCUIT TESTING; GENERALIZED FINITE ELEMENTS; LIFE ESTIMATION; MECHANICAL FATIGUE; SOLDER JOINT FATIGUE; SURFACE MOUNT PACKAGE; WEIBULL FAILURE DISTRIBUTION;

TIN;

EID: 84889365003     PISSN: 15417026     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/RELPHY.2002.996627     Document Type: Conference Paper

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