Original software component manufacturing: Survey of the State-of-the-Practice

Conference Proceedings of the EUROMICRO

Volumn , Issue , 2001, Pages 138-145

  Seppänen, Veikko ^a   Helander, Nina ^a   Niemela, Eila ^b   Komi Sirviö, Seija ^b  

^a UNIVERSITY OF OULU   (Finland)

^b VTT TECHNICAL RESEARCH CENTRE OF FINLAND   (Finland)

Author keywords

[No Author keywords available]

Indexed keywords

ORIGINAL EQUIPMENT MANUFACTURING; PAPER ANALYSIS; SOFTWARE COMPONENT; STRATEGIC PARTNERSHIP;

MICROWAVE CIRCUITS;

MANUFACTURE;

EID: 84889031129     PISSN: 10896503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EURMIC.2001.952448     Document Type: Conference Paper

References (4)

1. Niemela, E., Kuikka, S., Vilkuna.K., Lampola, M., Ahonen, M., Forsell, M., Korhoncn, R., Seppanen, V., and Venta, O.2000.Teollisel komponentliohjelmistot.Kehittcimislarpeet fa toimenpide-ehdotukset. Teknologiakatsaus 89/2000.Technology Development Center of Finland Tekes (www.tekes.fi).129 p.(in Finnish, Abstract in English)
2. Chavez, A.Tornabene, C, and Wiederhold, G.1998."Software component licensing: A primer".IEEE Software, September/October, pp.47-53.
3. Aoyama, M., and Yamashita, T.1998."Software commerce broker over the internet".Proc.of the 22nd Annual International Computer Software and Applications Conference (COMPSAC '98), pp.430-435.
4. Robinson, W.N.1997."Electronic brokering for assisted contracting of software applets".Proc.of the 30th Hawaii International Conference on System Sciences, vol.4.pp.449-458.