Copper foil/carbon nanotube array thermal interface materials used for CPU burn-in

2007 Proceedings - 24th International VLSI Multilevel Interconnection Conference, VMIC 2007

Volumn , Issue , 2007, Pages 320-323

  Cola, Baratunde A ^a,b   Maschmann, Matthew R ^b   Henry, Christopher ^b   Fisher, Timothy S ^a  

^a PURDUE UNIVERSITY   (United States)

^b INTEL CORPORATION   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BURN-IN; CARBON NANOTUBE ARRAY; COPPER FOILS; NANOTUBE ARRAYS; SYSTEM THERMAL RESISTANCES; THERMAL INTERFACE MATERIALS; THERMOMECHANICAL CYCLES;

CARBON NANOTUBES; COPPER; ELECTRONIC EQUIPMENT; THERMAL INSULATING MATERIALS;

INTERFACES (MATERIALS);

EID: 84888272578     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (2)

1. Cola, B. A., Xu, J., Cheng, C, Hu, H., Xu, X., and Fisher, T. S., 2007, "Photoacoustic Characterization of Carbon Nanotube Array Interfaces," J. Appl. Phys. 101, 054313 9pp.
2. Cola, B. A., Xu, X., and Fisher, T. S., 2007, "Increased Real Contact in Thermal Interfaces: A Carbon Nanotube/foil Material," Appl. Phys. Lett. 90, 093513 3pp.