Optimization of CMP PAD groove arrays for improved slurry transport, wafer profile correction, and defectivity reduction

2005 Proceedings - 10th International Chemical-Mechanical Planarization for ULSI Multilevel Interconnection Conference, CMP-MIC 2005

Volumn , Issue , 2005, Pages 156-167

  Muldowney, Gregory P ^a  

^a ROHM AND HAAS COMPANY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTATIONAL MODEL; DEFECTIVITY REDUCTION; FLOW AND TRANSPORT; FUNDAMENTAL STUDIES; SCRATCH REDUCTION; SURFACE FLOW RESISTANCE; WAFER CONTACTS; WAFER VELOCITIES;

ATMOSPHERIC TEMPERATURE; MECHANICAL PROPERTIES; OPTIMIZATION; SLURRIES;

CHEMICAL MECHANICAL POLISHING;

EID: 84888220824     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

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