An initial study of aerosol jet® printed interconnections on extrusion-based 3d-printed substrates vog

Strojniski Vestnik/Journal of Mechanical Engineering

Volumn 59, Issue 11, 2013, Pages 689-696

  Vogeler, Frederik ^a   Verheecke, Wesley ^a   Voet, André ^a   Valkenaers, Hans ^a  

^a Thomas More University College   (Belgium)

Author keywords

Aerosol jet printing; Conductive tracks; Extrusion based 3d printing; Interconnects; Printed tracks; Silver ink

Indexed keywords

3-D PRINTING; ADDITIVE MANUFACTURING; COMPLEMENTARY TECHNIQUES; CONDUCTIVE TRACKS; ELECTRICALLY CONDUCTIVE; MULTIFUNCTIONAL PROPERTIES; PRINTED TRACKS; SILVER INKS;

AEROSOLS; ELECTRIC PROPERTIES; EXTRUSION; FLOW RATE; MICROMETERS; OPTICAL INTERCONNECTS; SILVER; THREE DIMENSIONAL;

INK JET PRINTING;

EID: 84887959454     PISSN: 00392480     EISSN: None     Source Type: Journal    
DOI: 10.5545/sv-jme.2013.999     Document Type: Article

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