High yield intra-cavity interconnection fabrication method and characterization methodologies

2007 International Conference on Compound Semiconductor Manufacturing Technology, CS MANTECH 2007

Volumn , Issue , 2007, Pages 151-154

  Yajima, M ^a   Chang Chien, P ^a   Zeng, X ^a   Luo, K ^a   Cheung, C ^a   Tornquist, K ^a   Barsky, M ^a  

^a NORTHROP GRUMMAN CORPORATION   (United States)

Author keywords

Heterogeneous integration; Interconnections; Test structures; Wafer bonding; Wafer level packaging

Indexed keywords

FABRICATION METHOD; HETEROGENEOUS INTEGRATION; INTERCONNECTIONS; NORTHROP GRUMMAN SPACE TECHNOLOGIES; PRODUCTION ENVIRONMENTS; TEST STRUCTURE; WAFER BONDING TECHNIQUES; WAFER LEVEL PACKAGING;

INDUSTRIAL ENGINEERING; WAFER BONDING;

SEMICONDUCTOR DEVICE MANUFACTURE;

EID: 84887460002     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (4)

1. P. Chang-Chien, K. Tornquist, M. Nishimoto, C. Geiger, J. Lee, M. Truong, J. Uyeda, L. Lembo, M. Barsky, R. Lai, and A. Oki. "Low-temperature, Hermetic, High Yield, Wafer-Level Packaging Technology" Northrop Grumman Technology Review Journal, Vol 14, Spring/summer 2006, pp. 77-97.
2. P. Chang-Chien, K. Tornquist, M. Truong, C. Geiger, J. Lee, J. Uyeda, R. Grundbacher, R. Lai and A. Oki, "Low Temperature Wafer-Level Packaging for RF MEMS Switches", Government Microcircuit Application Conference (GOMAC), Apr. 2005, Las Vegas, NV, paper number 6.4.
3. P. Chang-Chien, K. Tornquist, Z. Xianglin, K. Luo, J. Yang, K. Kho, J. Uyeda, R. Lai and A. Oki, "Dense Intra-Cavity Interconnection Technology for Hermetically Packaged MMICs", State-of-the-Art Program on Compound Semiconductors 45 (SOTAPOCS 45), Oct. 2006, Cancun, Mexico, Abs# 1532.
4. P. Chang-Chien, K. Tornquist, D. Farkas, M. Nishimoto, M. Truong, R. Lai and A. Oki, "Low Temperature Wafer-Level Packaging for MMICs", Government Microcircuit Application Conference (GOMAC), March. 2006, San Diego, CA, paper number 6.4 154.