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Volumn , Issue , 2012, Pages
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Successful GaAs backend process improvement
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Author keywords
Breakage reduction; Grinding; Thinning; Yield
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Indexed keywords
DECISION MAKING PROCESS;
GAAS WAFER;
PROBLEM SOLVING METHODS;
PROCESS IMPROVEMENT;
REDUCTION STRATEGY;
SIX-SIGMA METHODOLOGY;
THINNING;
YIELD;
GALLIUM ARSENIDE;
GRINDING (MACHINING);
SEMICONDUCTOR DEVICE MANUFACTURE;
SEMICONDUCTING GALLIUM;
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EID: 84887386074
PISSN: None
EISSN: None
Source Type: Conference Proceeding
DOI: None Document Type: Conference Paper |
Times cited : (2)
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References (0)
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