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Volumn , Issue , 2012, Pages

Successful GaAs backend process improvement

Author keywords

Breakage reduction; Grinding; Thinning; Yield

Indexed keywords

DECISION MAKING PROCESS; GAAS WAFER; PROBLEM SOLVING METHODS; PROCESS IMPROVEMENT; REDUCTION STRATEGY; SIX-SIGMA METHODOLOGY; THINNING; YIELD;

EID: 84887386074     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper
Times cited : (2)

References (0)
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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.