Mechanics of finger-tip electronics

Journal of Applied Physics

Volumn 114, Issue 16, 2013, Pages

  Su, Yewang ^a,b   Li, Rui ^c   Cheng, Huanyu ^b   Ying, Ming ^d   Bonifas, Andrew P ^d   Hwang, Keh Chih ^a   Rogers, John A ^d   Huang, Yonggang ^b  

^a TSINGHUA UNIVERSITY   (China)

^b Northwestern University   (United States)

^c DALIAN UNIVERSITY OF TECHNOLOGY   (China)

^d University of Illinois at Urbana Champaign   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ANALYTIC MODELS; EMBEDDED DEVICE; MAXIMUM STRAINS; QUANTITATIVE VALIDATION; RADIUS OF CURVATURE; SENSORS AND ACTUATORS; TACTILE SENSORS; THREE-DIMENSIONAL DEVICES;

SENSORS; SILICONES; VIRTUAL REALITY;

THREE DIMENSIONAL;

EID: 84887291496     PISSN: 00218979     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.4828476     Document Type: Article

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