Effects on etching rates of copper in ferric chloride solutions

2nd 1998 IEMT/IMC Symposium

Volumn 1998-April, Issue , 1998, Pages 144-148

  Jian, C ^a   Jusheng, M ^a   Gangqiang, W ^a   Xiangyun, T ^a  

^a TSINGHUA UNIVERSITY   (China)

Author keywords

[No Author keywords available]

Indexed keywords

CHLORINATION; CHLORINE COMPOUNDS; COPPER COMPOUNDS; IRON COMPOUNDS; MICROELECTRONICS; PASSIVATION;

CU ETCHING; ETCHING RATE; ETCHING TIME; FERRIC CHLORIDE SOLUTION; PASSIVATION FILM; SPENT ETCHANT; SPRAY ETCHING;

ETCHING;

EID: 84887275352     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/IEMTIM.1998.704541     Document Type: Conference Paper

References (6)

1. R. Ueda, "Chemical Machining with a Ferric Chloride Etchant", Corrosion Engineering, 38, 271 ~ 282, 1989.
2. Ma Jusheng, Li Lingchuan, An Bai, "Etching mechanism and factors on precision of IC lead frame", J. of Tsinghua University (Science and Technology), 1996, 36(S1), 30-35.
3. Allen D M, "The Principle and Practice of Photochemical Machining and Photoetching", Bristol: IOP Limited, 1986
4. Maria Georgiadou, Richard Alkire, "Anisotropic Chemical Etching of Copper Foil, I", J. Electrochem. Soc, 140(5), 1340(1993).
5. Maria Georgiadou, Richard Alkire, "Anisotropic Chemical Etching of Copper Foil, II", J. Electrochem. Soc, 140(5), 1348(1993).
6. Khobotova B, Gorobets S D, "Mechanism of the Anodic Dissolution of Copper in Iron(III) Chloride Solutions", Zh. Prikl. Khim. (S.-Peterburg), 1991, 64(4), 785.