Electrochemical capacitor behavior of copper sulfide (CuS) nanoplatelets

Journal of Alloys and Compounds

Volumn 586, Issue , 2014, Pages 191-196

  Justin Raj, C ^a   Kim, Byung Chul ^a   Cho, Won Je ^a   Lee, Won Gil ^a   Seo, Yongseong ^a   Yu, Kook Hyun ^a  

^a Dongguk University   (South Korea)

Author keywords

Copper sulfide; Electrochemical reactions; Impedance spectroscopy; Scanning electron microscopy; Thin films; X ray diffraction

Indexed keywords

CHEMICAL BATH DEPOSITION TECHNIQUE; COPPER SULFIDES; EFFECT OF HEAT TREATMENTS; ELECTROCHEMICAL CAPACITOR; ELECTROCHEMICAL REACTIONS; ELECTROCHEMICAL SUPERCAPACITOR; GALVANOSTATIC CHARGE/DISCHARGE; IMPEDANCE SPECTROSCOPY;

CAPACITORS; COPPER; CYCLIC VOLTAMMETRY; ELECTROCHEMICAL ELECTRODES; ELECTROCHEMICAL IMPEDANCE SPECTROSCOPY; SCANNING ELECTRON MICROSCOPY; SILVER; SPECTROSCOPY; THIN FILMS; X RAY DIFFRACTION;

SULFUR COMPOUNDS;

EID: 84886731227     PISSN: 09258388     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.jallcom.2013.10.056     Document Type: Article

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