Feasibility of Monolithic and 3D-Stacked DC-DC Converters for Microprocessors in 90nm Technology Generation

Proceedings of the International Symposium on Low Power Electronics and Design

Volumn 2004-January, Issue January, 2004, Pages 263-268

  Schrom, Gerhard ^a   Hazucha, Peter ^a   Hahn, Jae Hong ^a   Kursun, Volkan ^b   Gardner, Donald ^a   Narendra, Siva ^a   Karnik, Tanay ^a   De, Vivek ^a  

^a INTEL CORPORATION   (United States)

^b UNIVERSITY OF ROCHESTER   (United States)

Author keywords

3 D integration; DC DC converter; integrated magnetics; on die switching converter; power delivery

Indexed keywords

CMOS INTEGRATED CIRCUITS; ELECTRIC POWER TRANSMISSION; LOW POWER ELECTRONICS; MICROPROCESSOR CHIPS; POWER CONVERTERS; POWER ELECTRONICS; SWITCHING CIRCUITS; THREE DIMENSIONAL INTEGRATED CIRCUITS;

3-D INTEGRATION; DE-COUPLING CAPACITANCE; DECOUPLING CAPACITOR; INTEGRATED MAGNETICS; ON-DIE SWITCHING CONVERTERS; POWER DELIVERY; SWITCHING DC-DC CONVERTERS; THIN FILM INDUCTORS;

DC-DC CONVERTERS;

EID: 84886673002     PISSN: 15334678     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/LPE.2004.241035     Document Type: Conference Paper

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