Thermally actuated tunable liquid microlens with sub-second response time

Applied Physics Letters

Volumn 103, Issue 11, 2013, Pages

  Ashtiani, Alireza Ousati ^a   Jiang, Hongrui ^a,b  

^a Wisconsin Electric Machines and Power Electronics Consortium   (United States)

^b UNIVERSITY OF WISCONSIN SCHOOL OF MEDICINE AND PUBLIC HEALTH   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

DIRECT CONTACT; LIQUID MICRO-LENS; THERMAL RESPONSE; THERMOELECTRIC DEVICES; TUNABLE LIQUID MICROLENS; VOLUME CHANGE; WATER MENISCUS; WATER TEMPERATURES;

THERMAL EXPANSION;

MICROLENSES;

EID: 84884272454     PISSN: 00036951     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.4820772     Document Type: Article

References (19)

1. X. Zeng, C. Smith, J. Gould, C. Heise, and H. Jiang, J. Microelectromech. Syst. 20, 583 (2011). 10.1109/JMEMS.2011.2127456
2. D. Zhu, X. Zeng, C. Li, and H. Jiang, J. Microelectromech. Syst. 20, 389 (2011). 10.1109/JMEMS.2011.2105858
3. A. Werber and H. Zappe, Appl. Opt. 44, 3238 (2005). 10.1364/AO.44.003238
4. B. Berge, in Proceedings of the 18th IEEE International Conference on Micro Electro Mechanical Systems (MEMS), Miami, FL, 30 Jan-3 Feb, 2005, pp. 227-230.
5. S. Kuiper and B. H. W. Hendriks, Appl. Phys. Lett. 85, 1128 (2004). 10.1063/1.1779954
6. C. U. Murade, D. van der Ende, and F. Mugele, Opt. Express 20, 18180 (2012). 10.1364/OE.20.018180
7. F. Li and F. Mugele, Appl. Phys. Lett. 92, 244108 (2008). 10.1063/1.2945803
8. B. Berge and J. Peseux, Eur. Phys. J. E 3, 159 (2000). 10.1007/s101890070029
9. S. T. Choi, J. Y. Lee, J. O. Kwon, S. Lee, and W. Kim, Proc. SPIE 7208, 72080P (2009). 10.1117/12.811401
10. T. Kaneko, T. Ohmi, N. Ohya, N. Kawahara, and T. Hattori, in Proceedings of the IEEE International Conference on Solid-State Sensors Actuators, Chicago, IL, 1997, pp. 63-66.
11. C. A. López and A. H. Hirsa, Nature Photon. 2, 610 (2008). 10.1038/nphoton.2008.198
12. P. M. Moran, S. Dharmatilleke, A. H. Khaw, K. W. Tan, M. L. Chan, and I. Rodriguez, Appl. Phys. Lett. 88, 041120 (2006). 10.1063/1.2168245
13. H. Ren, S. Xu, and S. Wu, Lab Chip 13, 100 (2013). 10.1039/c2lc40953d
14. L. Dong, A. K. Agarwal, D. J. Beebe, and H. Jiang, Nature (London) 442, 551 (2006). 10.1038/nature05024
15. L. Dong, A. K. Agarwal, D. J. Beebe, and H. Jiang, Adv. Mater. 19, 401 (2007). 10.1002/adma.200601561
16. D. Zhu, C. Lo, C. Li, and H. Jiang, J. Microelectromech. Syst. 21, 1146 (2012). 10.1109/JMEMS.2012.2196492
17. K. Lee, K. Park, G. Lim, H. Kim, and S. H. Kong, J. Opt. Soc. Korea 16, 22 (2012). 10.3807/JOSK.2012.16.1.022
18. A. Werber and H. Zappe, J. Microelectromech. Syst. 17, 1218 (2008). 10.1109/JMEMS.2008.928712
19. See supplementary material at http://dx.doi.org/10.1063/1.4820772 E-APPLAB-103-013337 for the detailed device fabrication process flow.