Comprehensive understanding of conductive filament characteristics and retention properties for highly reliable ReRAM

Digest of Technical Papers - Symposium on VLSI Technology

Volumn , Issue , 2013, Pages

  Muraoka, S ^a   Ninomiya, T ^b   Wei, Z ^b   Katayama, K ^b   Yasuhara, R ^b   Takagi, T ^b  

^a Automotive and Industrial Systems Company   (Japan)

^b PANASONIC CORPORATION   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

CONDUCTIVE FILAMENTS; LOW CURRENTS; OXYGEN DIFFUSION; PERCOLATION PATH; RESIDUAL OXYGEN; RETENTION DEGRADATION; RETENTION PROPERTIES;

EID: 84883323514     PISSN: 07431562     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (4)

1. Z. Wei et al., IEDM Tech. Dig., 721-724 (2011)
2. T. Ninomiya et al., VLSI. Tech. Dig., 73-74 (2012)
3. H. Zhang et al., in Proc. SISPAD, 1-4 (2009)
4. Y.M. Strelinker et al., Phys. Rev. E, 72, 016121 (2005)