Magnetic alignment of hexagonal boron nitride platelets in polymer matrix: Toward high performance anisotropic polymer composites for electronic encapsulation

ACS Applied Materials and Interfaces

Volumn 5, Issue 15, 2013, Pages 7633-7640

  Lin, Ziyin ^a   Liu, Yan ^a   Raghavan, Sathyanarayanan ^b   Moon, Kyoung Sik ^a   Sitaraman, Suresh K ^a   Wong, Ching Ping ^a,c  

^a Georgia Institute of Technology   (United States)

^b GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

^c CHINESE UNIVERSITY OF HONG KONG   (Hong Kong)

Author keywords

coefficient of thermal expansion; hexagonal boron nitride; magnetic alignment; polymer composite; thermal conductivity

Indexed keywords

ANISOTROPIC PROPERTY; ENHANCED THERMAL CONDUCTIVITY; EXTERNAL MAGNETIC FIELD; HEXAGONAL BORON NITRIDE; HEXAGONAL BORON NITRIDE (H-BN); MAGNETIC ALIGNMENT; MODERN MICROELECTRONICS; POLYMER COMPOSITE;

ALIGNMENT; ANISOTROPY; BORON NITRIDE; COMPOSITE MATERIALS; FILLERS; MICROELECTRONICS; PLATELETS; THERMAL CONDUCTIVITY; THERMAL EXPANSION;

LOADING;

EID: 84882807646     PISSN: 19448244     EISSN: 19448252     Source Type: Journal    
DOI: 10.1021/am401939z     Document Type: Article

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