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Journal of Materials Science

Volumn 48, Issue 21, 2013, Pages 7446-7455

Microstructure and properties of metakaolin-based inorganic polymer foams

(4) Hung, Tu Cheng a Huang, Jong Shin a Wang, Yi Wen a Fan, Ya Chu a

a NATIONAL CHENG KUNG UNIVERSITY (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

ACTIVATING SOLUTIONS; CELL-WALL THICKNESS; COEFFICIENT OF THERMAL CONDUCTIVITIES; INORGANIC BINDERS; MICROSTRUCTURE AND PROPERTIES; THERMAL AND MECHANICAL PROPERTIES; VARIOUS DENSITIES; WATER/BINDER RATIOS;

BLAST FURNACES; COMPRESSIVE STRENGTH; INORGANIC POLYMERS; MECHANICAL PROPERTIES; MICROSTRUCTURE; POWDERS; SLAGS; THERMAL CONDUCTIVITY;

BINDERS;

EID: 84882607450 PISSN: 00222461 EISSN: 15734803 Source Type: Journal
DOI: 10.1007/s10853-013-7559-3 Document Type: Article

Times cited : (20)

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