Utilizing an adaptive grey model for short-term time series forecasting: A case study of wafer-level packaging

Mathematical Problems in Engineering

Volumn 2013, Issue , 2013, Pages

  Chang, Che Jung ^a   Li, Der Chiang ^b   Dai, Wen Li ^c   Chen, Chien Chih ^b  

^a CHUNG YUAN CHRISTIAN UNIVERSITY   (Taiwan)

^b NATIONAL CHENG KUNG UNIVERSITY   (Taiwan)

^c TAINAN UNIVERSITY OF TECHNOLOGY   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

FORECASTING TECHNIQUES; FORECASTING TOOLS; GREY SYSTEM THEORY; PACKAGING PROCESS; POTENTIAL SOLUTIONS; SEMICONDUCTOR MANUFACTURING; TIME SERIES FORECASTING; WAFER LEVEL PACKAGING;

FORECASTING; PACKAGING; SEMICONDUCTOR DEVICE MANUFACTURE; TOOLS;

ELECTRONICS PACKAGING;

EID: 84881432892     PISSN: 1024123X     EISSN: 15635147     Source Type: Journal    
DOI: 10.1155/2013/526806     Document Type: Article

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