Wavelength selectable hybrid III-V/Si laser fabricated by wafer bonding

IEEE Photonics Technology Letters

Volumn 25, Issue 16, 2013, Pages 1582-1585

  Liepvre, Alban Le ^a   Accard, Alain ^a   Poingt, Francis ^a   Jany, Christophe ^a   Lamponi, Marco ^a   Make, Dalila ^a   Lelarge, Francois ^a   Fedeli, Jean Marc ^b   Messaoudene, Sonia ^b   Bordel, Damien ^b   Duan, Guang Hua ^a  

^a THALES RESEARCH AND TECHNOLOGY   (France)

^b CEA LETI   (France)

Author keywords

hybrid laser; III V laser; laser tuning; Photonic integrated circuit; silicon on insulator (SOI) technology; wafer bonding

Indexed keywords

HYBRID LASERS; LASER FEEDBACK; PHOTONIC INTEGRATED CIRCUITS; SILICON ON INSULATOR; SILICONON-INSULATOR TECHNOLOGY (SOI); THRESHOLD CURRENTS; WAFER BONDING TECHNIQUES; WAVELENGTH CHANNELS;

ARRAYED WAVEGUIDE GRATINGS; LASER TUNING; SINGLE MODE FIBERS; WAFER BONDING;

SILICON ON INSULATOR TECHNOLOGY;

EID: 84881425796     PISSN: 10411135     EISSN: None     Source Type: Journal    
DOI: 10.1109/LPT.2013.2271322     Document Type: Article

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