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Volumn 542, Issue , 2013, Pages 399-403
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Vacuum nanogap formation in multilayer structures by an adhesion-controlled process
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Author keywords
Adhesion; Electroplating; Nanogap; Thermoelectric; Thermotunnel; Tunneling
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Indexed keywords
LOW ADHESION;
MULTILAYER STRUCTURES;
NANO-GAP;
SI SUBSTRATES;
THERMO-TUNNELING;
THERMOELECTRIC;
THERMOTUNNEL;
THIN METAL FILMS;
ADHESION;
COPPER;
ELECTRODES;
ELECTRON TUNNELING;
ELECTROPLATING;
ENERGY CONVERSION;
METALLIC FILMS;
MICHELSON INTERFEROMETERS;
MULTILAYERS;
SEPARATION;
SILICON;
SUBSTRATES;
THERMAL EXPANSION;
VACUUM;
SILVER;
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EID: 84881310227
PISSN: 00406090
EISSN: None
Source Type: Journal
DOI: 10.1016/j.tsf.2013.06.089 Document Type: Article |
Times cited : (2)
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References (25)
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