Fast thermal analysis on GPU for 3D ICs with integrated microchannel cooling

IEEE Transactions on Very Large Scale Integration (VLSI) Systems

Volumn 21, Issue 8, 2013, Pages 1526-1539

  Feng, Zhuo ^a   Li, Peng ^b  

^a Michigan Technological University   (United States)

^b Texas AandM University   (United States)

Author keywords

3D integrated circuits; full chip thermal simulation; graphics processing units; iterative methods; massively parallel computing; microchannel cooling

Indexed keywords

3-D INTEGRATED CIRCUIT; GRAPHICS PROCESSING UNIT; MASSIVELY PARALLEL COMPUTING; MICROCHANNEL COOLING; THERMAL SIMULATIONS;

ALGORITHMS; COMPUTER GRAPHICS; COOLING; HEAT SINKS; INTEGRATED CIRCUITS; ITERATIVE METHODS; MICROCHANNELS; PARALLEL ARCHITECTURES; PROGRAM PROCESSORS; THERMOANALYSIS; THREE DIMENSIONAL;

COMPUTER GRAPHICS EQUIPMENT;

EID: 84881090236     PISSN: 10638210     EISSN: None     Source Type: Journal    
DOI: 10.1109/TVLSI.2012.2211050     Document Type: Article

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