Thermal decomposition of epoxy resin contained in printed circuit boards from reactive dynamics using the ReaxFF reactive force field

Acta Chimica Sinica

Volumn 70, Issue 19, 2012, Pages 2037-2044

  Diao, Zhijun ^a   Zhao, Yuemin ^a   Chen, Bo ^b   Duan, Chenlong ^a  

^a CHINA UNIVERSITY OF MINING AND TECHNOLOGY   (China)

^b NORTHWEST UNIVERSITY   (China)

Author keywords

Epoxy resin; Printed circuit boards; Reactive dynamics simulations; ReaxFF; Thermal decomposition

Indexed keywords

EID: 84880816762     PISSN: 05677351     EISSN: None     Source Type: Journal    
DOI: 10.6023/A12070451     Document Type: Article

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