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Volumn 9, Issue 29, 2013, Pages 7158-7166
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Micromechanics of temperature sensitive microgels: Dip in the Poisson ratio near the LCST
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Author keywords
[No Author keywords available]
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Indexed keywords
COMPRESSIVE ELASTIC MODULUS;
CROSS-LINKING DENSITY;
ENVIRONMENTAL CONDITIONS;
INCREASING TEMPERATURES;
LOWER CRITICAL SOLUTION TEMPERATURE;
POLYN-ISOPROPYLACRYLAMIDE;
SHEAR ELASTIC MODULUS;
TEMPERATURE SENSITIVE;
ACRYLIC MONOMERS;
ELASTIC MODULI;
ELASTICITY;
GELS;
HYDROGELS;
MICROMECHANICS;
POISSON RATIO;
TEMPERATURE;
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EID: 84880024768
PISSN: 1744683X
EISSN: 17446848
Source Type: Journal
DOI: 10.1039/c3sm50917f Document Type: Article |
Times cited : (67)
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References (41)
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