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Volumn 9, Issue 29, 2013, Pages 7158-7166

Micromechanics of temperature sensitive microgels: Dip in the Poisson ratio near the LCST

Author keywords

[No Author keywords available]

Indexed keywords

COMPRESSIVE ELASTIC MODULUS; CROSS-LINKING DENSITY; ENVIRONMENTAL CONDITIONS; INCREASING TEMPERATURES; LOWER CRITICAL SOLUTION TEMPERATURE; POLYN-ISOPROPYLACRYLAMIDE; SHEAR ELASTIC MODULUS; TEMPERATURE SENSITIVE;

EID: 84880024768     PISSN: 1744683X     EISSN: 17446848     Source Type: Journal    
DOI: 10.1039/c3sm50917f     Document Type: Article
Times cited : (67)

References (41)


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.