Effects of dual component microcapsules of resin and curing agent on the self-healing efficiency of epoxy

Composites Part B: Engineering

Volumn 55, Issue , 2013, Pages 79-85

  Li, Qi ^a   Siddaramaiah, ^b   Kim, Nam Hoon ^a   Hui, David ^c   Lee, Joong Hee ^a,b  

^a Chonbuk National University   (South Korea)

^b SRI JAYACHAMARAJENDRA COLLEGE OF ENGINEERING   (India)

^c UNO College of Engineering   (United States)

Author keywords

A. Thermosetting resin; B. Mechanical properties; D. Thermal analysis; E. Cure

Indexed keywords

DIFFERENTIAL SCANNING CALORIMETRIC; DIGLYCIDYL ETHER OF BISPHENOL-A; EMULSION SOLVENT EVAPORATION; FOURIER TRANSFORM INFRARED SPECTROSCOPY (FT-IR); SINGLE COMPONENTS; STRUCTURE AND MORPHOLOGY; THERMAL CHARACTERISTICS; WATER-IN-OIL-IN-WATER;

CURING; EFFICIENCY; EMULSIONS; MECHANICAL PROPERTIES; POLYMETHYL METHACRYLATES; RESINS; SCANNING ELECTRON MICROSCOPY; TENSILE STRENGTH; THERMOANALYSIS; THERMOGRAVIMETRIC ANALYSIS;

EPOXY RESINS;

EID: 84879972666     PISSN: 13598368     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.compositesb.2013.06.006     Document Type: Article

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