Curing behavior of dicyandiamide/epoxy resin system using different accelerators

Iranian Polymer Journal (English Edition)

Volumn 22, Issue 8, 2013, Pages 591-598

  Hayaty, Mehran ^a,b   Honarkar, Hengameh ^a   Beheshty, Mohammad Hosain ^a  

^a IRAN POLYMER AND PETROCHEMICAL INSTITUTE   (Iran)

^b MALEK ASHTAR UNIVERSITY OF TECHNOLOGY   (Iran)

Author keywords

Accelerator; Curing behavior; Dicyandiamide; Epoxy resin; Mechanical properties

Indexed keywords

BENZYL DIMETHYL AMINE; CURING BEHAVIOR; DICYANDIAMIDE; DIFFERENTIAL SCANNING CALORIMETRY METHODS; DIGLYCIDYL ETHER OF BISPHENOL-A; GLASS CHOPPED STRAND MAT; OPTIMUM CONCENTRATION; STOICHIOMETRIC RATIO;

DIFFERENTIAL SCANNING CALORIMETRY; EPOXY RESINS; GLASS; MECHANICAL PROPERTIES; PARTICLE ACCELERATORS; REINFORCEMENT; RESINS; TENSILE STRENGTH; UREA;

CURING;

EID: 84879803563     PISSN: 10261265     EISSN: 17355265     Source Type: Journal    
DOI: 10.1007/s13726-013-0158-y     Document Type: Article

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