Busbarless emitter wrap-through solar cells and modules

Conference Record of the IEEE Photovoltaic Specialists Conference

Volumn , Issue , 2008, Pages

  Hacke, Peter ^a   Murphy, Brian ^a   Meakin, David ^a   Dominguez, Jason ^a   Jaramillo, Johnny ^a   Yamasaki, Michael ^a   Gee, James ^a  

^a Advent Solar Inc   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BACK-CONTACT CELLS; CONDUCTIVE ADHESIVE; INTERNATIONAL ELECTROTECHNICAL COMMISSION; PHOTOVOLTAIC SOLAR CELLS; SERIES RESISTANCES; SILICON SUBSTRATES; THERMAL CYCLING TEST; WRAP-THROUGH SOLAR CELLS;

ELECTRIC RESISTANCE; METALLIZING; SILICON WAFERS; SILVER;

SOLAR CELLS;

EID: 84879725027     PISSN: 01608371     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/PVSC.2008.4922442     Document Type: Conference Paper

References (5)

1. D. D. Smith, J. M. Gee, M. D. Bode, and J. C. Jimeno, IEEE Trans. Electron Devices (46) 1999.
2. P. Hacke, J. Gee, M. Hilali, J. Dominguez, H. Dundas, G. Lopez, R. Marquardt, B Fischer, B. Sopori, 21 st European Photovoltaic Solar Energy Conference, Dresden, Sept. 4-8, 2006, p. 761.
3. D. W. K. Eikelboom et. at., Proc. 17th EPVSEC (2001) 1547.
4. P. Hacke et. al., Proc. 31 st IEEE PVSC, 1181.
5. M. Hilali, P. Hacke, J. Gee, Proc 4th WCPEC (2006), Vol. 2. 1299.