Towards a better understanding of the thermo-mechanical behavior of H-pattern cells during metallization

Conference Record of the IEEE Photovoltaic Specialists Conference

Volumn , Issue , 2008, Pages

  Van Amstel, T ^a   Bennett, I J ^a  

^a TNO   (Netherlands)

Author keywords

[No Author keywords available]

Indexed keywords

BREAKING STRESS; CELL THICKNESS; FORCE-DISPLACEMENT CURVES; FOUR POINT BEND TESTS; FOUR-POINT BENDING; METALLIZATION PROCESS; THERMO-MECHANICAL BEHAVIORS; THREE DIMENSIONAL FINITE ELEMENTS;

METALLIZING;

EID: 84879711243     PISSN: 01608371     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/PVSC.2008.4922691     Document Type: Conference Paper

References (3)

1. P. Lolgen, "Surface and volume recombination in silicon solar cells", PhD. Thesis, University of Utrecht, 1995
2. J. Westra, "Joining and mechanical behavior of poly crystalline solar cells", Maters Thesis, Delft University of Technology, 2008
3. G. Coletti, N. J. C. M. van der Borg, S. De luliis, C. J. J. Tool, L. J. Geerligs, "Mechanical strength of silicon wafers depending on wafer thickness and surface treatment", proceedings of the 21st European Photovoltaic Solar Energy Conference and Exhibition, Dresden, pp. 1281-1284, 2006