CMP process control for advanced CMOS device integration

ECS Transactions

Volumn 44, Issue 1, 2012, Pages 543-552

  Huey, Sidney ^a   Chandrasekaran, Balaji ^a   Bennett, Doyle ^a   Tsai, Stan ^a   Xu, Kun ^a   Qian, Jun ^a   Dhandapani, Siva ^a   David, Jeff ^a   Swedek, Bogdan ^a   Karuppiah, Lakshmanan ^a  

^a APPLIED MATERIALS INC   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CMOS INTEGRATED CIRCUITS; COST EFFECTIVENESS; HIGH-K DIELECTRIC; SEMICONDUCTOR DEVICE MANUFACTURE;

ADVANCED CMOS DEVICE; CONTROL TECHNOLOGIES; COPPER CMP; COST-EFFECTIVE SOLUTIONS; HIGH-K METAL GATES; INTEGRATION SCHEME; NEW DEVICES; PROFILE CONTROL;

PROCESS CONTROL;

EID: 84878603336     PISSN: 19385862     EISSN: 19386737     Source Type: Conference Proceeding    
DOI: 10.1149/1.3694367     Document Type: Conference Paper

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