Antibacterial activity by alloying of tin & copper plating

National Association for Surface Finishing Annual Technical Conference 2005, SUR/FIN 2005

Volumn , Issue , 2005, Pages 497-503

  Lkigai, Hajime ^a   Kanematsu, Hideyuki ^a   Kuroda, Kensuke ^b   Ohmori, Akira ^c  

^a SUZUKA NATIONAL COLLEGE OF TECHNOLOGY   (Japan)

^b NAGOYA UNIVERSITY   (Japan)

^c OSAKA UNIVERSITY   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

ANTI-BACTERIAL ACTIVITY; ANTI-MICROBIAL ACTIVITY; CULTURE TECHNIQUES; FILM ADHESION; KLEBSIELLA PNEUMONIAE; MEDICAL INSTRUMENTS; PROCESSING APPLICATIONS; STAPHYLOCOCCUS AUREUS;

ALLOYING; BACTERIA; COPPER; COPPER PLATING; FINISHING; SOCIETIES AND INSTITUTIONS; TIN; TIN PLATE;

FOOD PROCESSING;

EID: 84878351302     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (3)

1. Hajime Ikigai, Hideyuki Kanematsu, Yasushi Kikuchi & Takeo Oki, Proc. AESF SUR/FIN 2004, p.996 (2004)
2. Hideyuki Kanematsu, Hajime Ikigai, Kensuke Kuroda & Yasushi Kikuchi, Current Advances in Materials and Processes (Report of the ISIJ Meeting), Vol.17(No.6), p.1127 (2004)
3. Hajime Ikigai, Bulletin of Tokai Kagaku Kougyoukai, No.242, p.7 (2004)