Wafer-level integration of high-quality bulk piezoelectric ceramics on silicon

IEEE Transactions on Electron Devices

Volumn 60, Issue 6, 2013, Pages 2022-2030

  Aktakka, Ethem Erkan ^a   Peterson, Rebecca L ^a   Najafi, Khalil ^a  

^a UNIVERSITY OF MICHIGAN   (United States)

Author keywords

Microelectromechanical systems; micromachining; piezoelectric films; thin film devices; wafer bonding

Indexed keywords

AVERAGE SURFACE ROUGHNESS; LEAD MAGNESIUM NIOBATE-LEAD TITANATES; LEAD ZIRCONIUM TITANATE; PIEZOELECTRIC FILM; PIEZOELECTRIC STRAIN COEFFICIENTS; PIEZOELECTRIC SUBSTRATES; REMNANT POLARIZATIONS; WAFER-LEVEL INTEGRATION;

ELECTROMECHANICAL DEVICES; INTEGRATION; INTERFACES (MATERIALS); MEMS; MICROMACHINING; PIEZOELECTRIC CERAMICS; PIEZOELECTRICITY; SILICON; THIN FILM DEVICES; WAFER BONDING;

SILICON WAFERS;

EID: 84878163408     PISSN: 00189383     EISSN: None     Source Type: Journal    
DOI: 10.1109/TED.2013.2259240     Document Type: Article

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