Dielectric properties improvement of polymer composite prepared from poly(vinylidene difluoride) and barium-modified porous clay heterostructure

Electronic Materials Letters

Volumn 9, Issue 3, 2013, Pages 315-323

  Bunnak, Natthaphon ^a   Laoratanakul, Pitak ^b   Bhalla, Amar S ^c   Manuspiya, Hathaikarn ^a  

^a CHULALONGKORN UNIVERSITY   (Thailand)

^b NATIONAL METAL AND MATERIALS TECHNOLOGY CENTER   (Thailand)

^c UNIVERSITY OF TEXAS AT SAN ANTONIO   (United States)

Author keywords

barium modified porous clay heterostructure; dielectric properties; poly(vinylidene difluoride) composite

Indexed keywords

COMPRESSION METHODS; HEAT RESISTANT; MECHANICAL AND THERMAL PROPERTIES; NON-POLAR PHASE; POLY(VINYLIDENE DIFLUORIDE); POLYMER COMPOSITE; PROPERTIES IMPROVEMENTS; PVDF FILMS;

BARIUM; COMPOSITE FILMS; DIELECTRIC PROPERTIES; HETEROJUNCTIONS;

DIELECTRIC PROPERTIES OF SOLIDS;

EID: 84878093063     PISSN: 17388090     EISSN: 20936788     Source Type: Journal    
DOI: 10.1007/s13391-012-2210-z     Document Type: Article

References (36)

1. J. W. Gilman, J. Appl. Clay Sci. 15, 31 (1999).
2. K. A. Carrado, J. Appl. Clay Sci. 17, 1 (2000).
3. M. S. Lakshmi, B. Narmadha, and B. S. R. Reddy, J. Polym. Degrad. Stabil. 93, 201 (2008).
4. M. V. Burmistr, K. M. Sukhyy, V. V. Shilov, and P. Pissis, J. Polym. Degrad. Stabil. 46, 12226 (2005).
5. G. S. Xeidakis, J. Eng. Geol. 44, 93 (1996).
6. Y. J. Du and S. Hayashi, J. Appl. Clay Sci. 32, 14 (2006).
7. K. Srithammaraj, R. Magaraphan, and H. Manuspiya, J. Adv. Mat. Res. 55-57, 317 (2008).
8. A. Jindapech, R. Magaraphan, and H. Manuspiya, Master Degree, Induced Magnetic Properties to Surface-modified Mesoporous Clay Heterostructure for Anti-corrosion Packaging, p. 36, Chulalongkorn University, the Petroleum and Petrochemical College (2010).
9. N. Bunnak, P. Laoratanakul, A. S. Bhalla, and H. Manuspiya, J. Ferroelectircs. Volume in honor of Dr. Amar Bhalla (special issue): in press (2013).
10. M. L. Yeowa, R. W. Field, K. Lia, and W. K. Teo, J. Membr. Sci. 203, 137 (2002).
11. Y. M. Zhenga, S. W. Zoua, K. G. N. Nanayakkaraa, T. Matsuurab, and J. P. Chena, J. Membr. Sci. 374, 1 (2011).
12. D. Suwansumpan, H. Manuspiya, P. Laoratanakul, and A. S. Bhalla, J. Adv. Mat. Res. 55-57, 101 (2008).
13. K. Kohpaiboon, P. Laoratanakul, and H. Manuspiya, Master Degree, 0-3 Connectivity of PVDF/BST Piezoelectric Composites, p. 36, Chulalongkorn University, The Petroleum and Petrochemical College (2007).
14. V. Osta {eth} evičius, I. Mila {eth} auskaitė, R. Dauk {eth} evičius, V. Baltru{eth}aitis, V. Grigaliūnas, and I. Prosyčevas, J. Mechanika. 6, 78 (2010).
15. A. J. Lovinger and T. T. Wang, J. Polymer20, 725 (1979).
16. S. Lanceros-M'endez, J. F. Mano, A. M. Costa, and V. H. Schmidt, J. Macromol. Sci. Part B-Phys. 40, 517 (2001).
17. S. Yano, J. Polym. Sci. Part A-2-Polym. Phys. 8, 1057 (1970).
18. Y. Wang, M. Cakmak, and J. L. White, J. Appl. Polym. Sci. 30, 2615 (1985).
19. A. K. Zak, W. C. Gan, W. H. A. Majid, M. Darroudi, and T. S. Velayutham, J. Ceram. Int. 37, 1653 (2011).
20. Y. J. Shen and P. P. Chu, Proceedings of the 8th Asian Conference on Solid State Ionics: Trends in the New Millennium (Eds., B. V. R. e. a. Chowdari), p. 361, World Scientific Pub. Co. Inc., Malaysia (2002).
21. W. Zhou, J. Zuo, and W. Ren, J. Compos. Part-A. 43, 658 (2012).
22. I. Y. Phang, K. Pramoda, T. Liu, and C. He, J. Polym. Int. 53, 1282 (2004).
23. L. A. Utracki, Clay-containing Polymeric Nanocomposites (Eds., R. Technology), p. 395, iSmithers Rapra, UK (2004).
24. B. Wang and L. Gu, Mater. Lett. 57, 361 (2002).
25. H. Y. Hwang, D. J. Kim, H. J. Kim, Y. T. Hong, and S. Y. Nam, J. T. Nonferr. Metal. Soc. 21, s141 (2011).
26. W. Z. Nie, J. Li, and X. Z. Li, J. Fiber. Polym. 11, 559 (2011).
27. X. Dong, Y. Hu, J. Zhao, and Y. Wu, J. Physcia B. 405, 3551 (2010).
28. X. Yi, H. L. Duan, Y. Chen, and J. Wang, Phys. Lett. 372, 68 (2007).
29. A. Liu, X. Wang, L. Wang, H. Wang, and H. Wang, Eur. Polym. J. 43, 989 (2007).
30. R. K. Goyal, S. S. Katkade, and D. M. Mule, J. Compos. Part B44, 128 (2013).
31. Y. Kobayashi, T. Tanase, T. Tabata, T. Miwa, and M. Konno, J. Eur. Ceram. Soc. 28, 117 (2008).
32. S. O. Kasap, Chapter 5 Semiconductors (Eds., Mcgraw-Hill), p. 373, Suzanne Jeans, Canada (2005).
33. Y. P. Wang, Z. H. Gao, R. M. Wang, H. G. Liu, C. Yang, and Y. B. Xiong, J. React. Funct. Polym. 68, 1170 (2008).
34. F. Qu, L. Zhu, and K. Yang, J. Hazard. Mat. 170, 7 (2009).
35. L. Chmielarza, B. Gila, P. Kućtrowskia, Z. Piwowarskaa, B. Dudeka, and M. Michalik, J. Sol. St. Phen. 182, 1094 (2009).
36. M. J. Pan, E. Gorzkowski, and K. M. Allister, IOP Conference Series: Materials Science and Engimeering (Eds., J. S. Gardner), p. 1, IOP Publishing, Japan (2011).