Integration of BST varactors with surface acoustic wave device by film transfer technology for tunable RF filters

Journal of Micromechanics and Microengineering

Volumn 23, Issue 2, 2013, Pages

  Hirano, Hideki ^a   Kimura, Tetsuya ^b   Koutsaroff, Ivoyl P ^b   Kadota, Michio ^b   Hashimoto, Ken Ya ^c   Esashi, Masayoshi ^a   Tanaka, Shuji ^a  

^a TOHOKU UNIVERSITY   (Japan)

^b MURATA MANUFACTURING CO LTD   (Japan)

^c CHIBA UNIVERSITY   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

DC BIAS VOLTAGE; FILM TRANSFER PROCESS; FREQUENCY TUNING RANGE; LITHIUM NIOBATE; METAL-INSULATOR-METAL STRUCTURES; RESONANCE FREQUENCIES; SAW RESONATORS; VARIABLE CAPACITOR;

ACOUSTIC SURFACE WAVE DEVICES; GOLD; SILICON; SILICON WAFERS; VARIABLE FREQUENCY OSCILLATORS; WAFER BONDING;

MIM DEVICES;

EID: 84877967167     PISSN: 09601317     EISSN: 13616439     Source Type: Journal    
DOI: 10.1088/0960-1317/23/2/025005     Document Type: Article

References (26)

1. Harada H 2008 A small-size software defined cognitive radio prototype PIMRC'08: Proc. IEEE 19th Int. Symp. Personel, Indoor and Mobile Radio Commun. (Cannes, France,)
2. Abidi A A 2007 The path to the software-defined radio receiver IEEE J. Solid-State Circuits 42 954-66 (Pubitemid 46645015)
3. Komatsu T, Hashimoto K, Omori T and Yamaguchi M 2010 Tunable radio-frequency filters using acoustic wave resonators and variable capacitors Japan. J. Appl. Phys. 49 07HD24
4. Yasue T, Komatsu T, Nakamura N, Hashimoto K, Hirano H, Esashi M and Tanaka S 2012 Wideband tunable Love wave filter using electrostatically-actuated MEMS variable capacitors integrated on lithium niobate Sensors Actuators A 188 456-62
5. 3 thin films for tunable microwave devices J. Electron. Mater. 32 1125-34
6. Bao P, Jackson T J, Wang X and Lancaster M J 2008 Barium strontium titanate thin film varactors for room-temperature microwave device applications J. Phys. D: Appl. Phys. 41 063001
7. Pervez N K, Hansen P J and York R A 2004 High tunability barium strontium titanate thin films for RF circuit applications Appl. Phys. Lett. 85 4451-53 (Pubitemid 40001543)
8. Jamil A, Kalkur T S and Cramer C 2007 Tunable ferroelectric capacitor-based voltage controlled oscillator IEEE Trans. Ultrason. Ferroelectr. Freq. Control 54 222-6 (Pubitemid 46376113)
9. Nath J, Ghosh D, Maria J P, Kingon A I, Fathelbab W, Franzon P D and Steer M B 2005 An electronically tunable microstrip bandpass filter using thin-film barium-strontium-titanate (BST) varactors IEEE Trans. Microw. Theory Technol. 53 2707-12 (Pubitemid 41633193)
10. 2 /HR-Si substrate for reconfigurable radio IEEE Trans. Utrason. Ferroelectr. Freq. Control 54 2227-32 (Pubitemid 350249397)
11. 3+z thin films prepares by RF magnetron sputtering Integr. Ferroelectr. 46 221-32 (Pubitemid 44915049)
12. Vetelino K, Welsh P, Aguirre M and Abbott B 2004 RF-SAW filter on pyro-suppressed wafers Proc. IEEE Ultrason. Symp. pp 449-52
13. Ogihara M et al 2006 LED array integrated with Si driving circuits for LED printer printhead Electron. Lett. 42 881-3 (Pubitemid 44116666)
14. Schelcher G, Brault S, Parrain P, Lefeuvre E, Dufour-Gergam E, Tatoulian M, Bouville D, Desgeorges M, Verjus F and Bosseboeuf A 2011 MEMS process by film transfer using a fluorocarbon anti-adhesive layer J. Electrochem. Soc. 158 H545-50
15. Niklaus F, Kalvesten E and Stemme G 2001 Wafer-level membrane transfer bonding of polycrystalline silicon bolometers for use in infrared focal plane arrays J. Micromech. Microeng. 11 509-13 (Pubitemid 32897674)
16. Guerre R, Drechsler U, Daniel J and Despont M 2008 Low-cost AFM cantilever manufacturing technology J. Micromech. Microeng. 18 115013
17. 3 thin films on micromachined Si substrates using room-temperature transfer bonding LTB-3D: Proc 3rd IEEE Int. Workshop Low Temperature Bonding 3D Integration) p 105
18. Baron T, Gachon D, Romand J P, Alzuaga S, Ballandras S, Masson J, Catherinot L and Chatras M 2010 A pressure sensor based on a HBAR micromachined structure FCS: IEEE Int. Frequency Control Symp. pp 361-4
19. 3 -substrate structure Japan. J. Appl. Phys. 43 3063-6
20. 3 waveguide chips on Si substrates by low-temperature solid-state bonding of Au IEEE J. Sel. Top. Quantum Electron. 17 652-8
21. Kim Y S and Smith R T 1969 Thermal expansion of Lithium Tantalate and Lithium Niobate single crystals J. Appl. Phys. 40 4637-41
22. 3 thin-film capacitors J. Vac. Sci. Technol. B 19 2231-6 (Pubitemid 34089724)
23. Shibano T and Oomori T 1997 Sidewall deposition film in platinum etching with Ar/halogen mixed gas plasmas J. Vac. Sci. Technol. B 15 1747-51 (Pubitemid 127604318)
24. Chung C W and Song H G 1997 Study on fence-free platinum etching using chlorine-based gases in inductively coupled plasma J. Electrochem. Soc. 144 L294-6
25. 3 thin films using inductively coupled plasma J. Vac. Sci. Technol. A 19 1063-7 (Pubitemid 32699412)
26. 3 /Xe gases for microstructuring of Au, Pt, Cu, and 20% Fe-Ni J. Vac. Sci. Technol. B 21 2159