Commercial-off-the-shelf 3D integration using low temperature ws

IMAPS International Conference and Exhibition on Device Packaging - In Conjunction with the Global Business Council, GBC 2011 Spring Conference

Volumn , Issue , 2011, Pages 49-54

  Lee, Sang Hwui ^a   Khbeis, Michael ^a  

^a LABORATORY FOR PHYSICAL SCIENCES   (United States)

Author keywords

Low temperature wafer bonding; Plasma surface activation; Polyimide; Wt

Indexed keywords

BONDING TECHNOLOGY; COMMERCIAL-OFF-THE-SHELF; COVALENT BONDING; LONG-TERM ANNEALING; LOW TEMPERATURE WAFER BONDING; PLASMA SURFACES; THROUGH-SILICON-VIA (TSV); WT;

BONDING; DIES; EXHIBITIONS; INTEGRATION; POLYIMIDES; SIGNAL PROCESSING; SILICON; SILICON WAFERS; TEMPERATURE; THREE DIMENSIONAL COMPUTER GRAPHICS;

WAFER BONDING;

EID: 84877866836     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (7)

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7. Chenxi Wang, et al, "A novel room-temperature wafer direct bonding method by fluorine containing plasma activation, " IEEE ECTC, pp. 303-308, 2010.