Morphologies and corrosion resistances of electroless Ni-P coated nanoporous coppers

Science China Technological Sciences

Volumn 56, Issue 5, 2013, Pages 1147-1150

  Yang, Qing ^a,b   Liang, Shuhua ^a,b   Wang, Jia ^a   Wang, Ying ^a  

^a XI'AN UNIVERSITY OF TECHNOLOGY   (China)

^b Shaanxi Province Key Laboratory for Electrical Materials and Infiltration Technology   (China)

Author keywords

complexing agent; corrosion resistance; electroless plating; morphology; nanoporous copper; Ni P coating

Indexed keywords

CITRIC ACID; COPPER CORROSION; CORROSION RESISTANCE; ELECTROLESS PLATING; LACTIC ACID; MORPHOLOGY; NICKEL COMPOUNDS; SODIUM CHLORIDE; SODIUM HYDROXIDE;

CHANNEL STRUCTURES; COMPLEXING AGENTS; CORROSION POTENTIALS; ELECTROLESS NI-P; NANO-POROUS COPPERS; NANOPOROUS CHANNELS; NI-P COATING; PLATING SOLUTIONS;

CORROSION RESISTANT COATINGS;

EID: 84877802673     PISSN: 16747321     EISSN: 18691900     Source Type: Journal    
DOI: 10.1007/s11431-013-5185-6     Document Type: Article

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