Properties of glass-less photoimageable paste for multilayer LTCC structures fabrication

Proceedings - IMAPS/ACerS 8th International Conference and Exhibition on Ceramic Interconnect and Ceramic Microsystems Technologies, CICMT 2012

Volumn , Issue , 2012, Pages 307-313

  Maikowski, Piotr ^a   Zwierkowska, Elzbieta ^b   Jakubowska, Malgorzata ^b,c   Kielbasiriski, Konrad ^c   Muckett, Steve ^d  

^a WROCLAW UNIVERSITY OF TECHNOLOGY   (Poland)

^b ukasiewicz Research Network Institute of Microelectronics and Photonics   (Poland)

^c WARSAW UNIVERSITY OF TECHNOLOGY   (Poland)

^d Mozaik Technology Ventures Limited   (United Kingdom)

Author keywords

LTCC; Photoimageable; Photosensitive; Thick film

Indexed keywords

ELECTRICAL RESISTIVITY; EXTERNAL SURFACES; GOOD COMPATIBILITY; LTCC; PHOTOIMAGEABLE; PHOTOIMAGEABLE INKS; PHOTOSENSITIVE; SUBSTRATE ADHESION;

ELECTRIC CONDUCTIVITY; EXHIBITIONS; GLASS; MICROSYSTEMS; SILVER; SINTERING; SUBSTRATES; THICK FILMS;

CERAMIC MATERIALS;

EID: 84877751130     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (4)

1. Jakubowska M., Achmatowicz S., Baltrušaitis V., Młozniak A., Wyzkiewicz I., Zwierkowska E., Investigation on a new silver photoimageable conductor, Microelectronics Reliability, 48 (2008), pp. 860-865.
2. Achmatowicz S., Kiełbasinski K., Zwierkowska E., Wyzkiewicz I., Baltrušaitis V., Jakubowska M., A New Platinum Photoimageable Conductor, 32nd Int. Conf. of IMAPS CPMT IEEE Poland, IX 2008.
3. Markowski P., Miniaturized arms for threedimensional thick-film thermoelectric microgenerator, 35th Int. Conf. of IMAPS-Poland, IX 2011, pp. 153-156.
4. Nowak D., Dziedzic A., Hrovat M., Cilensek J., Miniaturization of thick-film resistors by laser-shaping, 33rd ISSE 2010 Conference, Warszawa, Poland, 2010, pp. 82-86.