A cost-effective alternative technology for wafer bumping - Electroless Ni/Au UBM deposition and ultra fine pitch printing of solder paste

IMAPS International Conference and Exhibition on Device Packaging - Co-located with the Global Business Council, GBC 2006 Spring Conference

Volumn , Issue , 2006, Pages

  Boettcher, Lars ^a   Ostmann, Andreas ^a   Manessis, Dionysios ^b   Aschenbrenner, Rolf ^a   Reichl, Herbert ^b  

^a FRAUNHOFER IZM   (Germany)

^b TECHNISCHE UNIVERSITÄT BERLIN   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

ALTERNATIVE TECHNOLOGIES; FLIP CHIP APPLICATIONS; LEAD-FREE SOLDER PASTE; MICROELECTRONICS PACKAGING; PRINTING EQUIPMENTS; SOLDER PASTE STENCIL PRINTING; SURFACE MOUNT ASSEMBLY; UNDER BUMP METALLIZATION;

COST EFFECTIVENESS; DEPOSITION; EXHIBITIONS; GOLD; LEAD; METALLIZING; MICROELECTRONICS; SOLDERING ALLOYS; SURFACE MOUNT TECHNOLOGY; TECHNOLOGY;

CHIP SCALE PACKAGES;

EID: 84877032119     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (4)

1. Manessis, D. et al, "Technical challenges of stencil printing technology for ultra fine pitch flip chip bumping", Journal Microelectronics Reliability, vol. 44 (2004), pp. 797-803.
2. Manessis, D. et al, "Stencil Printing Technology for 100 μm Pitch Flip Chip Bumping", The Global Assembly Journal for SMT Professionals, Vol., No. 2, (2004), pp. 10-14.
3. A. Ostmann et al. "Electroless Metal Deposition for Back-End Wafer Processes", Advancing Microelectronics, pp. 23-26, May/June 1999
4. Manessis, D. et al, "Technical challenges of stencil printing technology for ultra fine pitch flip chip bumping", Journal Microelectronics Reliability, vol. 44 (2004), pp. 797-803