Bond test methodologies for large aluminum ribbon

Proceedings - 2007 International Symposium on Microelectronics, IMAPS 2007

Volumn , Issue , 2007, Pages 933-940

  Wong, Garrett ^a   Oftebro, Kristian ^a  

^a Orthodyne Electronics   (United States)

Author keywords

Aluminum; PowerRibbon ; Ribbon bonding; Test methodology

Indexed keywords

BONDING EQUIPMENT; CONSISTENT QUALITY; EQUIPMENT OPERATORS; INTERCONNECT TECHNOLOGY; MATERIAL HANDLING; RELIABILITY ENGINEERS; STANDARD PRACTICES; TEST METHODOLOGY;

AUTOMOTIVE INDUSTRY; ELECTRONICS PACKAGING; EQUIPMENT TESTING; MICROELECTRONICS; PROCESS MONITORING;

ALUMINUM;

EID: 84876927518     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (3)

1. Haumann, S. & Luechinger, C.& Oftebro, K., " PowerRibbon™ - An Alternative Interconnect Technology for Small Power Packages", IMAPS 2006, 2006.
2. Harman, G. G., Wire Bonding in Microelectronics: Materials, Processes, Reliability, and Yield, McGraw-Hill Publishers, second edition, New York, Chapter 4, pp. 105-107, 1997.
3. Harman, G. G., Wire Bonding in Microelectronics: Materials, Processes, Reliability, and Yield, McGraw-Hill Publishers, second edition, New York, Chapter 4, pp. 68, 1997.