Improved thermal management in high power applications by utilizing novel "Filled Via" thin film substrate technology

Proceedings - 2007 International Symposium on Microelectronics, IMAPS 2007

Volumn , Issue , 2007, Pages 36-42

  Kaiser, A ^a   Ruess, K ^a   Holl, B ^a   Vanselow, J ^a   Feurer, E ^a   Kusterer, J ^b  

^a Reinhardt Microtech GmbH   (Germany)

^b UNIVERSITY OF ULM   (Germany)

Author keywords

AlN; Cu filled via; High power dissipation; Thermal management; Thin film

Indexed keywords

ALN; ELECTRICAL CONNECTION; ELECTRICAL RESISTANCES; HIGH PERFORMANCE SYSTEMS; HIGH POWER AMPLIFIER; HIGH POWER APPLICATIONS; HIGH THERMAL CONDUCTIVITY; MANAGEMENT CAPABILITIES;

ANTENNAS; ELECTRIC CONNECTORS; METALLIZING; MICROELECTRONICS; POWER AMPLIFIERS; RADAR ANTENNAS; TECHNOLOGY; TEMPERATURE CONTROL; THERMAL CONDUCTIVITY; THIN FILMS;

SUBSTRATES;

EID: 84876923854     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (4)

1. E. Feurer, B. Holl, J. Vanselow, K. Ruess, A. Kaiser: Advanced Thin Film Substrates in Cu-AlN Technology. Proceedings EMPC 2007 European Microelectronics and Packaging Conference, June 17-20, 2007, Oulu, Finland, pp. 522-525
2. http://www.memsnet.org/material~
3. http://www.matweb.com/~
4. http://www.mse-microelectronics.de/~