Power device assembly materials and processes for extreme environments

Proceedings - 2005 International Symposium on Microelectronics, IMAPS 2005

Volumn , Issue , 2005, Pages 632-637

  Liu, Yi ^a   Wang, Cai ^a   Johnson, R Wayne ^a   Palmer, Michael J ^a  

^a AUBURN UNIVERSITY   (United States)

Author keywords

Braze; Die attach; Extreme environments; Polyimide; SiC; Wire bonding

Indexed keywords

BRAZE; DIE-ATTACH; EXTREME ENVIRONMENT; SIC; WIRE BONDING;

ALUMINUM; ALUMINUM NITRIDE; BRAZING; CHIP SCALE PACKAGES; ELECTRIC BREAKDOWN; ELECTRIC CONDUCTIVITY; ELECTRIC EQUIPMENT; EUTECTICS; HIGH TEMPERATURE APPLICATIONS; MELTING POINT; METALLIZING; MICROELECTRONICS; NICKEL; POLYIMIDES; PREFORMING; QUARTZ; SILICON CARBIDE; SILICON NITRIDE; SILVER; SUBSTRATES; THERMAL CONDUCTIVITY; THERMAL CYCLING; TIN; WIRE;

GOLD;

EID: 84876905739     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (9)

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