Thermal, electrical and morphological properties of DGEBA/DDM and TGDDM/DDM epoxies modified by a flexible diepoxide and octaphenylamine-POSS

Journal of Reinforced Plastics and Composites

Volumn 32, Issue 9, 2013, Pages 602-611

  Chandramohan, A ^a   Mandhakini, M ^a   Dinakaran, K ^b   Alagar, M ^a  

^a ANNA UNIVERSITY   (India)

^b ANNA UNIVERSITY   (India)

Author keywords

Diepoxide; homogeneous; nanocrosslinker; POSS; retardancy; thermal

Indexed keywords

DIEPOXIDE; HOMOGENEOUS; NANOCROSSLINKER; POSS; RETARDANCY; THERMAL;

DIELECTRIC PROPERTIES; FOURIER TRANSFORM INFRARED SPECTROSCOPY; HYBRID SYSTEMS; METHANE; OLIGOMERS; REINFORCEMENT; RESINS; TRANSMISSION ELECTRON MICROSCOPY; X RAY DIFFRACTION ANALYSIS;

EPOXY RESINS;

EID: 84876789560     PISSN: 07316844     EISSN: 15307964     Source Type: Journal    
DOI: 10.1177/0731684413479838     Document Type: Article

References (39)

1. Pan Q, Chen X, Fan X, et al. Organic-inorganic hybrid bent-core liquid crystals with cubic silsesquioxane cores. J Mater Chem. 2008 ; 18: 3481-3488
2. Gojny FH, Wichmann MHG, Kopke U, et al. Carbon nanotube-reinforced epoxy composites: Enhanced stiffness and fracture toughness at low nanotube content. Compos Sci Technol. 2004 ; 64: 2363-2371
3. Katihabwa A, Wang W, Jiang Y, et al. Multi-walled carbon nanotubes/silicone rubber nanocomposites prepared by high shear mechanical mixing. J Reinf Plast Compos. 2011 ; 30 (12). 1007-1014
4. Park YJ, Lima DH, Kim HJ, Park, et al. UV- and thermal-curing behaviors of dual-curable adhesives based on epoxy acrylate oligomers. Inter J Adhes Adhes. 2009 ; 29 (7). 710-717
5. Zhang W, Picu RC, Koratkar N. The effect of carbon nanotube dimensions and dispersion on the fatigue behavior of epoxy nanocomposites. Nanotechnology. 2008 ; 19: 285709-285709
6. Fu J, Shi L, Chen Y, et al. Epoxy nanocomposites containing mercaptopropyl polyhedral oligomeric silsesquioxane: Morphology, thermal properties, and toughening mechanism. J Appl Polym Sci. 2008 ; 109 (1). 340-349
7. Goffin AL, Duquesne E, Raquez JM, et al. From polyester grafting onto POSS nanocage by ring-opening polymerization to high performance polyester/POSS nanocomposites. J Mater Chem. 2010 ; 20: 9415-9422
8. Madbouly SA, Otaigbe JU, Nanda AK, et al. Rheological behavior of POSS/polyurethane-urea nanocomposite films prepared by homogeneous solution polymerization in aqueous dispersions. Macromolecules. 2007 ; 40: 4982-4991
9. Jothibasu S, Premkumar S, Alagar M, et al. Synthesis and characterization of a POSS-maleimide precursor for hybrid nanocomposites. High Perform Polym. 2007 ; 20(1): 67-85
10. Nagendiran S, Alagar M, Hamerton I. Octasilsesquioxane-reinforced DGEBA and TGDDM epoxy nanocomposites: Characterization of thermal, dielectric and morphological properties. Acta Mater. 2010 ; 58: 3345-3356
11. Devaraju S, Vengatesan MR, Alagar M. Studies on thermal and dielectric properties of ether linked cyclohexyl diamine (ELCD)-based polyimide POSS nanocomposites (POSS-PI). High Perform Polym. 2011 ; 23 (2). 99-111
12. Vengatesan MR, Devaraju S, Dinakaran K, et al. Studies on thermal and dielectric properties of organo clay and octakis (dimethylsiloxypropylglycidylether) silsesquioxane filled polybenzoxazine hybrid nanocomposites. Polym Compos. 2011 ; 32: 1701-1711
13. Zhang Z, Wang X, Xie J, et al. Using octa(aminpropyl) silsesquioxane as the curing agent for epoxy resin. J Reinf Plast Compos. 2007 ; 26(16): 1665-1670
14. Chen WY, Wang YZ, Kuo SW, et al. Thermal and dielectric properties and curing kinetics of nanomaterials formed from poss-epoxy and meta- phenylenediamine. Polymer. 2004 ; 45 (20). 6897-6908
15. Liu H, Zheng S, Nie K. Morphology and thermomechanical properties of organic-inorganic hybrid composites involving epoxy resin and an incompletely condensed polyhedral oligomeric silsesquioxane. Macromolecules. 2005 ; 38: 5088-5097
16. Choi J, Kim SG, Laine RM. Organic/inorganic hybrid epoxy nanocomposites from aminophenyl silsesquioxanes. Macromolecules. 2004 ; 37: 99-109
17. Rashid ESA, Ariffin K, Kooi CC, et al. Preparation and properties of POSS/epoxy composites for electronic packaging applications. Mater Des. 2009 ; 30 (1): 1-8
18. Sanaria MR, Goddhani Baluja S, Prashana PH. Synthesis and characterization of 1,1′-bis(4-hydroxyphenyl)cyclohexane and 1,1′-bis(3-methyl-4-hydroxyphenyl)cyclohexane. J Polym Mater. 1998 ; 15: 45-49
19. Ni Y, Zheng S, Nie K. Morphology and thermal properties of inorganic-organic hybrids involving epoxy resin and polyhedral oligomeric silsesquioxanes. Polymer. 2004 ; 45 (16). 5557-5568
20. Ni Y, Zheng S. Epoxy resin containing octamaleimidophenyl polyhedral oligomeric silsesquioxane. Macromol Chem Phys. 2005 ; 206: 2075-2083
21. Raftopoulos KN, Pandis C, Apekis L, et al. Polyurethane-POSS hybrids: Molecular dynamics studies. Polymer. 2010 ; 51: 709-718
22. Liu H, Uhlherr A, Bannister MK. Quantitative structure-property relationships for composites: prediction of glass transition temperatures for epoxy resins. Polymer. 2004 ; 45: 2051-2060
23. Glodek TE, Boyd SE, McAninch IM, et al. Properties and performance of fire resistanteco-composites using polyhedral oligomeric silsesquioxane (POSS) fire retardants. Compos Sci Technol. 2008 ; 68: 2994-3001
24. Kim HU, Bang YH, Choi SM, et al. Morphology and mechanical properties of PET by incorporation of amine-polyhedral oligomeric silsesquioxane. Compos Sci Technol. 2008 ; 68: 2739-2747
25. Lu T, Liang G, Kou K, et al. Review Synthesis and characterization of cage octa(cyclohexylsilsesquioxane). J Mater Sci. 2005 ; 40 (18). 4721-4726
26. Strachota A, Whelan P, Kriz J, et al. Formation of nanostructured epoxy networks containing polyhedral oligomeric silsesquioxane (POSS) blocks. Polymer. 2007 ; 48: 3041-3058
27. Lin ST, Huang SK. Thermal degradation study of siloxane-DGEBA epoxy copolymers. Eur Polym J. 1997 ; 33(2): 365-373
28. Montero B, Ramirez C, Rico M, et al. Effect of an epoxy octasilsesquioxane on the thermodegradation of an epoxy/amine system. Polym Int. 2010 ; 59: 112-118
29. Zhang C, Babonneau F, Bonhomme C, et al. Highly porous polyhedral silsesquioxane polymers: Synthesis and characterization. J Am Chem Soc. 1998 ; 120: 8380-8391
30. Leu CM, Reddy M, Wei KH, et al. Synthesis and dielectric properties of polyimide-chain-end tethered polyhedral oligomeric silsesquioxane nanocomposites. Chem Mater. 2003 ; 15: 2261-2265
31. Roy M, Nelson JK, MacCrone RK, et al. Candidate mechanisms controlling the electrical characteristics of silica/XLPE nanodielectrics. J Mater Sci. 2007 ; 42: 3789-3799
32. Huang X, Xie L, Jiang P, et al. Morphology studies and ac electrical property of low density polyethylene/octavinyl polyhedral oligomeric silsesquioxane composite dielectrics. Eur Polym J. 2009 ; 45: 2172-2183
33. Popielarz R, Chiang CK, Nozaki R, et al. Dielectric properties of polymer/ferroelectric ceramic composites from 100 Hz to 10 GHz. Macromolecules. 2001 ; 34: 5910-5915
34. Singha S, Thomas MJ. Dielectric properties of epoxy nanocomposites. IEEE Transact Dielectr Elect Insul. 2008 ; 15: 12-23
35. Huang JC, He CB, Xiao Y, et al. Polyimide/POSS nanocomposites: interfacial interaction, thermal properties and mechanical properties. Polymer. 2003 ; 44: 4491-4499
36. Tamaki R, Choi J, Laine RM. A Polyimide nanocomposite from octa(aminophenyl) silsesquioxane. Chem Mater. 2003 ; 15: 793-797
37. Xu HY, Yang BH, Wang JF, et al. Preparation, Thermal Properties, and Tg increase mechanism of Poly(acetoxystyrene-co-octavinyl-polyhedral oligomeric silsesquioxane) hybrid nanocomposites. Macromolecules. 2005 ; 38: 10455-10460
38. Liu YR, Huang YD, Liu L. Effects of tri silanol isobutyl-POSS on thermal stability of methylsilicone resin. Polym Degrad Stab. 2006 ; 91: 2731-2738
39. Chiu YC, Chou IC, Tsai HC, et al. Morphology, thermal and mechanical properties of the polyhedral oligomeric silsesquioxane side chain epoxy hybrid material. J Appl Polym Sci. 2010 ; 118: 3723-3732