A drop-in die-attach solution for the high temperature lead-free BiAgX solder paste system

Proceedings - IMAPS International Conference and Exhibition on High Temperature Electronics, HiTEC 2012

Volumn , Issue , 2012, Pages 58-65

  Zhang, HongWen ^a   Lee, Ning Cheng ^a  

^a INDIUM CORPORATION   (United States)

Author keywords

BiAg; High temperature; Lead free; Mixed powder; Pb free; Solder; Solder joint; Solder paste; Voiding; Wetting

Indexed keywords

BIAG; HIGH TEMPERATURE; LEAD-FREE; MIXED POWDER; PB-FREE; SOLDER JOINTS; SOLDER PASTE; VOIDING;

LASERS; LEAD; MELTING; SILVER; SILVER ALLOYS; THERMAL AGING; THERMAL CYCLING; WETTING;

SOLDERING ALLOYS;

EID: 84876720613     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (5)

1. Chen S. W. et al. Phase equilibria ot the bn-bb Binary System ", Journal of Electronic Materials, Vol.37, No.7 (2008). pp.992-1002.
2. Takaku, Y. et al, " Interfacial Reaction between Cu substrate and Zn-Al base High-Temperature Pb-Free Solders", Journal of Electronic Materials, Vol.37, No.3(2008). pp.314-323.
3. Kim, S. et al. 'Interfacial Reaction and Die Attach Properties of Zn-Sn High-Temperature Sodlers" Journal of Electronic Materials. Vol. 38. No.2 (2009), pp.266-272.
4. Lalena, J. et al, " Experimental Investigation of Ge-doped BillAg as a New Pb-Free Solder alloys for Powder Die Attachment", Journal of Electronic Materials, Vol.31, No. 11(2002). pp. 1244-1249.
5. thSpring conference of Japan Institute of Electronics Packaging, 2012. pp231-232.