Experimental study of contact angle and active nuleation site distribution on nanostructure modified copper surface in pool boiling heat transfer enhancement

Heat Transfer Research

Volumn 44, Issue 1, 2013, Pages 115-132

  Nolan, Eric ^a   Rioux, Russell ^a   Jiang, Peixue ^b   Peterson, G P ^c   Li, Calvin Hong ^a  

^a Villanova University   (United States)

^b TSINGHUA UNIVERSITY   (China)

^c GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

Contact angle; Critical heat flux; Heat transfer coefficient; Nanostructured surface; Nucleation site density

Indexed keywords

ELECTRODEPOSITION TECHNIQUE; EXPERIMENTAL STUDIES; HEAT TRANSFER COEFFICIENT (HTC); NANOSTRUCTURED COPPER; NANOSTRUCTURED SURFACE; NUCLEATION SITE DENSITY; POOL BOILING HEAT TRANSFER; SITE DISTRIBUTION;

CONTACT ANGLE; COPPER; HEAT FLUX; HEAT TRANSFER COEFFICIENTS; NANOSTRUCTURES;

NUCLEATION;

EID: 84876573076     PISSN: 10642285     EISSN: None     Source Type: Journal    
DOI: 10.1615/HeatTransRes.2012005687     Document Type: Article

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