A 0.54pJ/b 20Gb/s ground-referenced single-ended short-haul serial link in 28nm CMOS for advanced packaging applications

Digest of Technical Papers - IEEE International Solid-State Circuits Conference

Volumn 56, Issue , 2013, Pages 404-405

  Poulton, John W ^a   Dally, William J ^a   Chen, Xi ^a   Eyles, John G ^a   Greer III, Thomas H ^a   Tell, Stephen G ^a   Gray, C Thomas ^a  

^a NVIDIA   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ADVANCED PACKAGING; COMPUTATIONAL POWER; ENERGY-PER-BIT; HIGH BANDWIDTH; HIGH-BANDWIDTH CHANNELS; MEMORY CAPACITY; SILICON INTERPOSERS; SINGLE-ENDED;

BANDWIDTH; PACKAGING; SILICON; SUBSTRATES;

TELECOMMUNICATION SYSTEMS;

EID: 84876545938     PISSN: 01936530     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ISSCC.2013.6487789     Document Type: Conference Paper

References (6)

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