Direct Cu-Cu thermo-compression bonding for 3D-stacked IC integration

Proceedings - 2006 International Symposium on Microelectronics, IMAPS 2006

Volumn , Issue , 2006, Pages 1252-1257

  Ruythooren, Wouter ^a   Stoukatch, Serguei ^a   Lambrinou, Konstantina ^a   De Moor, Piet ^a   Swiiinen, Bail ^a  

^a IMEC   (Belgium)

Author keywords

3D integration; Cu Cu bonding; Thermo compression; Through wafer interconnects

Indexed keywords

3-D INTEGRATION; BONDING CONDITIONS; BONDING TEMPERATURES; CU-CU BONDINGS; INTERCONNECT DENSITIES; THERMO COMPRESSION BONDING; THERMO-COMPRESSION; THROUGH-WAFER INTERCONNECTS;

BOND STRENGTH (MATERIALS); DIES; FLIP CHIP DEVICES; MICROELECTRONICS; SHEAR STRESS; SURFACE ROUGHNESS; THREE DIMENSIONAL COMPUTER GRAPHICS;

WAFER BONDING;

EID: 84876513137     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (1)

1. H. M. Ho, W. Lam, S. Stoukatch, P. Ratchev, C. J. Vath III, E. Beyne. "Advanced wire bonding: bonding on copper", Proceedings of the European Microelectronics Packaging and Interconnection Symposium (IMAPS - EUROPE 2002), Cracow, Poland, June 16-18, pp. 27-32, 2002.