Electrochemical and Physical Properties of Electroplated CuO thin films

Journal of Nanoscience and Nanotechnology

Volumn 13, Issue 1, 2013, Pages 250-259

  Dhanasekaran, V ^a   Mahalingam, T ^b  

^a ALAGAPPA UNIVERSITY   (India)

^b KARUNYA UNIVERSITY   (India)

Author keywords

Electrochemical preparation; Materials characterization; Thin films; XRD

Indexed keywords

COMPLEX DIELECTRIC CONSTANT; ELECTRICAL AND OPTICAL PROPERTIES; ELECTROCHEMICAL PREPARATION; EXTINCTION COEFFICIENT (K); MATERIALS CHARACTERIZATION; MICROSTRUCTURAL PARAMETERS; X-RAY LINE PROFILE ANALYSIS; XRD;

ACTIVATION ENERGY; CYCLIC VOLTAMMETRY; ELECTRIC PROPERTIES; OPTICAL CONDUCTIVITY; OPTICAL CONSTANTS; REFRACTIVE INDEX; SUBSTRATES; THIN FILMS;

FILM PREPARATION;

COPPER; CUPRIC OXIDE; NANOMATERIAL; TITANIUM; TITANIUM DIOXIDE;

ARTICLE; ARTIFICIAL MEMBRANE; CHEMISTRY; CONFORMATION; ELECTRIC CONDUCTIVITY; ELECTROPLATING INDUSTRY; MACROMOLECULE; MATERIALS TESTING; METHODOLOGY; PARTICLE SIZE; REFRACTOMETRY; SURFACE PROPERTY; ULTRASTRUCTURE;

COPPER; ELECTRIC CONDUCTIVITY; ELECTROPLATING; MACROMOLECULAR SUBSTANCES; MATERIALS TESTING; MEMBRANES, ARTIFICIAL; MOLECULAR CONFORMATION; NANOSTRUCTURES; PARTICLE SIZE; REFRACTOMETRY; SURFACE PROPERTIES; TITANIUM;

MLCS; MLOWN;

EID: 84876231990     PISSN: 15334880     EISSN: 15334899     Source Type: Journal    
DOI: 10.1166/jnn.2013.6709     Document Type: Article

References (41)

1. K. Tonooka, K. Shimokowa, and O. Nishimura, Thin Solid Films 411, 129 (2002).
2. J. Y. Xiang, J. P. Tu, X. H. Huang, and Y. Z. Yang, J. Solid State Electrochem. 12, 941 (2008).
3. Y. Xu, C. Wang, D. Chen, and X. Jiao, Mater. Lett. 64, 249 (2010).
4. A. Dutta, D. Das, M. L. Grilli, E. Di bartolomeo, and E. T. D. Chakravorty, J. Sol-Gel Sci. Technol. 26, 1085 (2003).
5. J. Morales, L. Sanchez, F. Martin, J. R. Ramos-Barrado, and M. Sanchez, J. Alloy. Compd. 509, 2094 (2011).
6. S. Ghosh, D. K. Avasthi, P. Shah, V. Ganesan, A. Gupta, D. Sarangi, R. Bhattacharya, and W. Assmann, Vacuum 57, 377 (2000).
7. A. Y. Oral, E. Mensur, M. H. Aslan, and E. Basaran, Mater. Chem. Phys. 83, 140 (2004).
8. M. T. S. Nair, L. Guerrero, O. L. Arenas, and P. K. Nair, Appl. Surf. Sci. 150, 143 (1999).
9. I. G. Casella and M. Gatta, Electroanal. Chem. 494, 12 (2000).
10. M. Paunovic and M. Schlesinger, Fundamentals of Electrochemical Deposition, Wiley, New York (1998).
11. M. J. Siegfried and K. S. Choi, Adv. Mater. 16, 1743 (2004).
12. M. J. Siegfried and K. S. Choi, J. Am. Chem. Soc. 128, 10356 (2006).
13. R. Liu, F. Oba, E. W. Bohannan, F. Ernst, and J. A. Switzer, Chem. Mater. 15, 4882 (2003).
14. P. Poizot, C. J. Hung, M. P. Nikiforov, E. W. Bohannan, and J. A. Switzer, Electrochem. Solid-State Lett. 6, C21 (2003).
15. S. Thanikaikarasan, T. Mahalingam, K. Sundaram, A. Kathalingam, Y. D. Kim, and T. Kim, Vacuum 83, 1066 (2009).
16. H. Zhang and M. Zhang, Mater. Chem. Phys. 108, 184 (2008).
17. V. P. Bhatt, K. Gireesan, and C. F. Desai, Cryst. Res. Technol. 24, 187 (1989).
18. M. P. R. Panicker, M. Knaster, and F. A. Kroger, J. Electrochem. Soc. 125, 566 (1978).
19. F. A. Kroger, J. Electrochem. Soc. 125, 2028 (1978).
20. R. Schrebler, M. A. del Valle, H. Gomez, C. Veas, and R. Cordova, J. Electroanal. Chem. 380, 219 (1995).
21. Q. Yang, P. X. Yan, J. B. Chang, J. J. Feng, and G. H. Yue, Phys. Lett. A 361, 493 (2007).
22. J. O. M. Bockris, D. Drazic, and A. R. Despic, Electrochim. Acta 4, 325 (1961).
23. I. G. Casella, T. R. I. Cataldi, A. Guerrieri, and E. Desimoni, Anal. Chim. Acta 335, 217 (1996).
24. K. Kano, M. Torimura, Y. Esaka, and M. Goto, J. Electroanal. Chem. 372, 137 (1994).
25. B. Wels and D. C. Johnson, J. Electrochem. Soc. 137, 2785 (1990).
26. Y. Xie and C. O. Huber, Anal. Chem. 63, 1714 (1991).
27. Y. Chang and H. C. Zeng, Cryst. Growth Des. 4, 397 (2004).
28. T. Mahalingam, V. Dhanasekaran, S. Thanikaikarasan, A. Kathalingam, and J.-K. Rhee, AIP Conf. Proc. 1447, 631 (2012).
29. Y. G. Gudage, N. G. Deshpande, and R. Sharma, J. Phys. Chem. Solids 70, 907 (2007).
30. S. B. Qadri, E. F. Skelton, D. Hsu, A. D. Dinsmore, J. Yang, H. F. Gray, and B. R. Rata, Phys. Rev. B 60, 9191 (1999).
31. S. Kose, F. Atay, V. Bilgin, and I. Akyuz, Mater. Chem. Phys. 111, 351 (2008).
32. JCPDS card No. 78-0428 (2003).
33. JCPDS card No. 89-5899 (1998).
34. J. C. Manitacier, J. Casiot, and P. Fillard, J. Phys. E 9, 1002 (1976).
35. R. S. Mane, B. R. Sankpal, and C. D. Lokhande, Mater. Chem. Phys. 64, 215 (2000).
36. A. Larena, F. Millan, G. Perez, and G. Pinto, Appl. Surf. Sci. 187, 339 (2002).
37. K. Subba Ramaiah and V. Sundara Raja, J. Mater. Sci.: Mater. Electron 10, 145 (1999).
38. R. Swanepoel, J. Phys. E 16, 1214 (1983).
39. R. Swanepoel, J. Phys. E 17, 896 (1984).
40. T. Mahalingam, V. Dhanasekaran, G. Ravi, R. Chandramohan, A. Kathalingam, and J.-K. Rhee, ECS Trans. 35, 1 (2011).
41. T. Mahalingam, V. Dhanasekaran, and G. Ravi, ECS Trans. 45, 95 (2012).