Enhancement of signal integrity and power integrity with embedded capacitors in high-speed packages

Proceedings - International Symposium on Quality Electronic Design, ISQED

Volumn , Issue , 2006, Pages 284-289

  Srinivasan, K ^a   Muthana, P ^a   Mandrekar, R ^a   Engin, E ^a   Choi, J ^a   Swaminathan, M ^a  

^a GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

DECOUPLING CAPACITOR; ELECTRICAL PERFORMANCE; EMBEDDED CAPACITOR; EMBEDDED PASSIVES; MICROELECTRONIC SYSTEMS; PLANAR CAPACITORS; POWER-GROUND PLANES; SIGNAL INTEGRITY;

ANTENNAS; COMPUTER SIMULATION; MICROELECTRONICS; SANITARY SEWERS;

CAPACITORS;

EID: 84875436164     PISSN: 19483287     EISSN: 19483295     Source Type: Conference Proceeding    
DOI: 10.1109/ISQED.2006.60     Document Type: Conference Paper

References (6)

1. Rao R. Tummala, Fundamentals of Microsystems Packaging. McGraw Hill, 2001.
2. R. Mandrekar and M. Swaminathan, "Causality enforcement in transient Simulation of passive networks through delay extraction", in Proc. Signal Propagation on Interconnects, 2005, pp. 25-28.
3. J.E. Schutt-Aine and R. Mittra, "Scattering parameter transient analysis of transmission lines loaded with nonlinear terminations", IEEE Trans. Microwave Theory Tech., vol. 36, pp. 529-536.
4. Joong Ho Kim, et al., "Modeling of irregular shaped power distribution planes using transmission matrix method", IEEE Trans. Adv. Packaging, vol. 24, no. 3, August 2001.
5. J. Dobrowolski, Introduction to Computer Methods for Microwave Circuit Analysis and Design, Norwood, MA: Artech House, 1991.
6. P. Muthana, et al., "Measurement, modeling and characterization of embedded capacitors for power delivery in the mid-frequency range", IMAPS 2005.