Packaging concepts for neuroprosthetic implants

16th European Microelectronics and Packaging Conference and Exhibition 2007, EMPC 2007

Volumn , Issue , 2007, Pages 677-680

  Topper M ^a,b   Klein, M ^a   Wilke, M ^a   Oppermann, H ^a   Kim, S ^b   Tathireddy, P ^b   Solzbacher, F ^b   Reichl, H ^a  

^a FRAUNHOFER IZM   (Germany)

^b Department of Electrical and Computer Engineering   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BRAIN INTERFACES; CHANNEL AMPLIFIERS; ELECTRICAL INTERCONNECTIONS; FERRITE SUBSTRATE; IN-VIVO EXPERIMENTS; INTERCONNECT TECHNOLOGY; SILICON-BASED STRUCTURES; WAFER-LEVEL INTEGRATION;

AMPLIFIERS (ELECTRONIC); DATA COMPRESSION; EXHIBITIONS; INTERFACES (MATERIALS); MICROELECTRONICS; POLYIMIDES;

CHIP SCALE PACKAGES;

EID: 84875329121     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (7)

1. Santhanam, G., Shenoy, K.V., "Methods for estimating neural step sequences in neural prosthetic applications," Proceedings IEEE EMBS. 1st International Conference on Neural Engineering, 2003, pp. 344-347.
2. Shenoy, K.V. et al., "Neural prosthetic control signals from plan activity," NeuroReport 14 (2003), pp. 591-596.
3. M. Töpper M. Klein, K. Buschick, V. Glaw, K. Orth, O. Ehrmann, M. Hutter, H. Oppermann, K.-F. Becker, T. Braun, F.Ebling, H. Reichl, Biocompatible hybrid flip chip microsystem integration for next generation wireless neural interfaces, Proceedings ECTC 2006, San Diego
4. Töpper, M., Tönnies, D., "Microelectronic Packaging" in Semiconductor Fabrication Handbook, Ed. Geng, M.H., McGraw-Hill(2005), pp. 21.1 - 21.54.
5. Hutter, M., Hohnke, H. Oppermann, M. Klein, G. Engelmann., "Assembly and Reliability of Flip Chip Solder Joints Using Miniaturized Au/Sn Bumps," Proc 54th Electronic Components and Technology Conf, Las Vegas, 2004.
6. Rieth, L. et al., "Switchable LTCC/ Polyimide Based Thin Film Coils," presented in 2005 Neural Interfaces Workshop, Bethesda, MD, Sep 2005
7. M. Wilke, M. Töpper, S. Kim, M. Klein, K.-H. Drüe, J. Müller, M. Wiemer, V. Glaw, H. Oppermann, F. Solzbacher, H. Reichl, Development of a caping process based on Si and LTCC for a wireless neuroprosthetic implant, S3 Workshop, Atlanta, October 2006