Nanowire-filled polymer composites with ultrahigh thermal conductivity

Applied Physics Letters

Volumn 102, Issue 9, 2013, Pages

  Balachander, Nikhil ^a   Seshadri, Indira ^a   Mehta, Rutvik J ^a   Schadler, Linda S ^a   Borca Tasciuc, Theo ^a   Keblinski, Pawel ^a   Ramanath, Ganpati ^a  

^a RENSSELAER POLYTECHNIC INSTITUTE   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRICAL CONDUCTIVITY; ENERGY DEVICES; FILLER-MATRIX; GOLD NANOWIRE; HIGH THERMAL CONDUCTIVITY; INTERFACIAL CONDUCTANCES; POLYMER COMPOSITE; ULTRAHIGH-THERMAL-CONDUCTIVITY;

ASPECT RATIO; ELECTRIC CONDUCTIVITY; FILLERS; NANOCOMPOSITES; NANOWIRES; SILICONES;

THERMAL CONDUCTIVITY;

EID: 84875208596     PISSN: 00036951     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.4793419     Document Type: Article

References (28)

1. R. Prasher, Proc. IEEE 94, 1571 (2006). 10.1109/JPROC.2006.879796
2. P. K. Schelling, L. Shi, and K. E. Goodson, Mater. Today 8, 30 (2005). 10.1016/S1369-7021(05)70935-4
3. B. A. Cola, X. Xu, and T. S. Fisher, Appl. Phys. Lett. 90, 093513 (2007). 10.1063/1.2644018
4. I. Balberg, N. Binenbaum, and N. Wagner, Phys. Rev. Lett. 52, 1465 (1984). 10.1103/PhysRevLett.52.1465
5. C. Wang, Y. Hu, C. M. Lieber, and S. Sun, J. Am. Chem. Soc. 130, 8902 (2008). 10.1021/ja803408f
6. N. R. Jana, Small 1, 875 (2005). 10.1002/smll.200500014
7. ASTM: Standard Test Method for Thermal Transmission Properties of Thin Thermally Conductive Solid Electrical Insulation Materials, Designation D5470-01, Work item WK5680.
8. ASTM: Standard Test Methods for DC Resistance or Conductance of Insulating Materials, Designation D257-07.
9. W. Oliver and G. J. Pharr, J. Mater. Res. 7, 1564 (1992). 10.1557/JMR.1992.1564
10. T. Maddanimath, A. Kumar, J. DArcy-Gall, P. Ganesan, K. Vijayamohanan, and G. Ramanath, Chem. Commun. 11, 1435 (2005). 10.1039/b414447n
11. P. Kundu, A. Halder, B. Viswanath, D. Kundu, G. Ramanath, and N. Ravishankar, J. Am. Chem. Soc. 132, 20 (2010). 10.1021/ja907874h
12. A. Munari, J. Xu, E. Dalton, A. Mathewson, and K. M. Razeeb, in 59th Electronic Components and Technology Conference (2009), pp. 448-452.
13. F. Yavari, H. R. Fard, K. Pashayi, M. A. Rafiee, A. Zamiri, R. Ozisik, T. Borca-Tasciuc, and N. Koratkar, J. Phys. Chem. C 115, 8753 (2011). 10.1021/jp200838s
14. S. Nikkeshi, M. Kudo, and T. Masuko, J. Appl. Polym. Sci. 69, 2593 (1998). 10.1002/(SICI)1097-4628(19980926)69:13<2593::AID-APP9>3.0.CO;2-5
15. J. Xu, A. Munari, E. Dalton, A. Mathewson, and K. M. Razeeb, J. Appl. Phys. 106, 124310 (2009). 10.1063/1.3271149
16. M. Biercuk, M. Llaguno, M. Radosavljevic, J. Hyun, A. Johnson, and J. Fischer, Appl. Phys. Lett. 80, 2767 (2002). 10.1063/1.1469696
17. H. Huang, C. H. Liu, Y. Wu, and S. S. Fan, Adv. Mater. 17, 1652 (2005). 10.1002/adma.200500467
18. K. M. F. Shahil and A. A. Balandin, Nano Lett. 12, 861 (2012). 10.1021/nl203906r
19. C. Nan, R. Birringer, D. Clarke, and H. Gleiter, J. Appl. Phys. 81, 6692 (1997). 10.1063/1.365209
20. S. T. Huxtable, D. G. Cahill, S. Shenogin, L. Xue, R. Ozisik, P. Barone, M. Usrey, M. S. Strano, G. Siddons, M. Shim, and P. Keblinski, Nature Mater. 2, 731 (2003). 10.1038/nmat996
21. D. Konatham and A. Striolo, Appl. Phys. Lett. 95, 163105 (2009). 10.1063/1.3251794
22. A. Yu, P. Ramesh, X. Sun, E. Bekyarova, M. E. Itkis, and R. C. Haddon, Adv. Mater. 20, 4740 (2008). 10.1002/adma.200800401
23. Y. Lu, J. Y. Huang, C. Wang, S. Sun, and J. Lou, Nat. Nanotechnol. 5, 218 (2010). 10.1038/nnano.2010.4
24. S. Agrawal, M. S. Raghuveer, R. Kroeger, and G. Ramanath, J. Appl. Phys. 100, 094314 (2006). 10.1063/1.2363816
25. T. Tong, Y. Zhao, L. Delzeit, A. Kashani, M. Meyyappan, and A. Majumdar, IEEE Trans. Compon. Packag. Technol. 30, 92 (2007). 10.1109/TCAPT.2007.892079
26. M. Piggott, Compos. Sci. Technol. 53, 201 (1995). 10.1016/0266-3538(95) 00019-4
27. N. R. Raravikar, A. S. Vijayaraghavan, P. Keblinski, L. S. Schadler, and P. M. Ajayan, Small 1, 317 (2005). 10.1002/smll.200400064
28. F. Carrillo, S. Gupta, M. Balooch, S. J. Marshall, G. W. Marshall, L. Pruitt, and M. J. Puttlitz, J. Mater. Res. 20, 2820 (2005). 10.1557/JMR.2005. 0354