Self-healing stretchable wires for reconfigurable circuit wiring and 3D microfluidics

Advanced Materials

Volumn 25, Issue 11, 2013, Pages 1589-1592

  Palleau, Etienne ^a   Reece, Stephen ^a   Desai, Sharvil C ^a   Smith, Michael E ^b   Dickey, Michael D ^a  

^a North Carolina State University   (United States)

^b ARKEMA INC   (United States)

Author keywords

3D microfluidics; liquid metal; reconfigurable electrical wiring; self healing polymer; stretchable wire

Indexed keywords

3-D MICROFLUIDIC; AMBIENT CONDITIONS; COMPLEX MICROFLUIDIC NETWORKS; DIFFERENT ORDER; ELECTRICAL WIRING; RECONFIGURABLE CIRCUITS; SELF-HEALING; SELF-HEALING POLYMERS;

COMPLEX NETWORKS; LIQUID METALS; SELF-HEALING MATERIALS; THREE DIMENSIONAL COMPUTER GRAPHICS; WIRE;

MICROFLUIDICS;

EID: 84875179070     PISSN: 09359648     EISSN: 15214095     Source Type: Journal    
DOI: 10.1002/adma.201203921     Document Type: Article

References (30)

1. D.-H. Kim, J.-H. Ahn, W. M. Choi, H.-S. Kim, T.-H. Kim, J. Song, Y. Y. Huang, Z. Liu, C. Lu, J. A. Rogers, Science 2008, 320, 507-511.
2. D. Kim, J. Xiao, J. Song, Y. Huang, J. A. Rogers, Adv. Mater. 2010, 22, 2108-2124.
3. M. C. LeMieux, Z. Bao, Nat. Nano. 2008, 3, 585-586.
4. J. A. Rogers, T. Someya, Y. Huang, Science 2010, 327, 1603-1607.
5. R. P. Wool, Soft Matter 2008, 4, 400.
6. D. Y. Wu, S. Meure, D. Solomon, Prog. Polym. Science 2008, 33, 479-522.
7. B. J. Blaiszik, S. L. B. Kramer, S. C. Olugebefola, J. S. Moore, N. R. Sottos, S. R. White, Annu. Rev. Mater. Res. 2010, 40, 179-211.
8. P. Cordier, F. Tournilhac, C. Soulié-Ziakovic, L. Leibler, Nature 2008, 451, 977-980.
9. Y. Li, S. Chen, M. Wu, J. Adv. Mater. 2012, 24, 4578-4582.
10. B. J. Blaiszik, S. L. B. Kramer, M. E. Grady, D. A. McIlroy, J. S. Moore, N. R. Sottos, S. R. White, Adv. Mater. 2012, 24, 398-401.
11. S. A. Odom, T. P. Tyler, M. M. Caruso, J. A. Ritchey, M. V. Schulmerich, S. J. Robinson, R. Bhargava, N. R. Sottos, S. R. White, M. C. Hersam, J. S. Moore, Appl. Phys. Lett. 2012, 101, 043106-043106-5.
12. K. A. Williams, A. J. Boydston, C. W. Bielawski, J. R. Soc. Interface 2007, 4, 359-362.
13. R. C. Chiechi, E. A. Weiss, M. D. Dickey, G. M. Whitesides, Angew. Chem. 2008, 120, 148-150.
14. J.-H. So, J. Thelen, A. Qusba, G. J. Hayes, G. Lazzi, M. D. Dickey, Adv. Funct. Mater. 2009, 19, 3632-3637.
15. M. Kubo, X. Li, C. Kim, M. Hashimoto, B. J. Wiley, D. Ham, G. M. Whitesides, Adv. Funct. Mater. 2010, 22, 2749-2752.
16. S. Cheng, A. Rydberg, K. Hjort, Z. Wu, Appl. Phys. Lett. 2009, 94, 144103-144103-3.
17. H.-J. Kim, C. Son, B. Ziaie, Appl. Phys. Lett. 2008, 92, 011904-011904-3.
18. J. Park, S. Wang, M. Li, C. Ahn, J. K. Hyun, D. S. Kim, D. K. Kim, J. A. Rogers, Y. Huang, S. Jeon, Nat. Comm. 2012, 3, 916.
19. H. Koo, J. So, M. D. Dickey, O. D. Velev, Adv. Mater. 2011, 23, 3559-3564.
20. J.-H. So, H. Koo, M. D. Dickey, O. D. Velev, Adv. Funct. Mater. 2012, 22, 625-631.
21. B. J. Lei, A. Zamora, T. F. Chun, A. T. Ohta, W. A. Shiroma, IEEE Micro. Wireless Comp. Lett. 2011, 9, 465-467.
22. M. R. Khan, G. J. Hayes, J. H. So, G. Lazzi, M. D. Dickey, Appl. Phys. Lett. 2011, 99, 013501.
23. J. Wang, S. Liu, A. Nahata, Opt. Express 2012, 20, 12119-12126.
24. J. Wang, S. Liu, Z. V. Vardeny, A. Nahata, Opt. Express 2012, 20, 2346-2353.
25. S. Cheng, Z. Wu, Lab Chip 2012, 12, 2782-2791.
26. J.-H. So, M. D. Dickey, Lab Chip 2011, 11, 905-911.
27. J. R. Anderson, D. T. Chiu, R. J. Jackman, O. Cherniavskaya, J. C. McDonald, H. Wu, S. H. Whitesides, G. M. Whitesides, Anal. Chem. 2000, 72, 3158-3164.
28. M. D. Dickey, R. C. Chiechi, R. J. Larsen, E. A. Weiss, D. A. Weitz, G. M. Whitesides, Adv. Funct. Mater 2008, 18, 1097-1104.
29. H. Wu, T. W. Odom, D. T. Chiu, G. M. Whitesides, J. Am. Chem. Soc. 2003, 125, 554-559.
30. W. Wu, A. DeConinck, J. A. Lewis, Adv. Mater. 2011, 23, 178-183.