An overview of smart conductive adhesive

EPE 2012 - Proceedings of the 2012 International Conference and Exposition on Electrical and Power Engineering

Volumn , Issue , 2012, Pages 88-93

  Niagu, Andrei ^a   Scarlatache, Vlad Andrei ^a   Ursache, Stefan ^a   Moraru, Georgiana Maria ^a  

^a Faculty of Electrical Engineering   (Romania)

Author keywords

Adhesive; bonding; resigns; thermoplast; thermoset

Indexed keywords

CONDUCTIVE ADHESIVE; MICROSCOPIC LEVELS; RESIGNS; THERMOPLAST;

ADHESIVES; BONDING; THERMOSETS;

ELECTRICAL ENGINEERING;

EID: 84874606910     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ICEPE.2012.6463946     Document Type: Conference Paper

References (6)

1. Edward M. Petrie, "Handbook of adhesives and Sealants", McGraw hill handbooks, October 1999.
2. Christine Salerni, "Adhesive Technologies for assembly of hard to bond plastics", Technical Market Manager for Henkel Loctite Corporation, October 2002.
3. Ferruccio Trifirò, Laura Forni, "Gli adesivi prodotti chimici caratterizzati come materiali", Chimica Industriale e dei Materiali-Università di Bologna.
4. http://www.adhesive.com.tw/hot melt adhesive.html
5. http://www.hot-melt adhesive bonding (November 2000) .htm.
6. http://www.NCI Hot Melt adhesives.htm